Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
特点
Kinetis® K20-100 MHz, Full-Speed USB, Mixed-Signal Integration Microcontrollers based on Arm® Cortex®-M4 Core
封装
LQFP144: LQFP144, plastic, low profile quad flat package; 144 terminals; 0.5 mm pitch; 20 mm x 20 mm x 1.4 mm body
购买选项
MK20DN512VLQ10
正常供应
12NC: 935323298557
详细信息
订购
工作特点
| 参数 | 值 |
|---|---|
Core Type | Arm Cortex-M4 |
Operating Frequency [Max] (MHz) | 100 |
SRAM (kB) | 128 |
Flash (kB) | 512 |
UART | 6 |
SPI | 3 |
I2C | 2 |
USB Controllers | 1 |
| 参数 | 值 |
|---|---|
CAN | 2 |
GPIO | 100 |
ADC (16 bit) | 2 |
16-bit PWM | 12 |
Security | CRC |
Supply Voltage [min] (V) | 1.71 |
Supply Voltage [max] (V) | 3.6 |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 105 |
环境
| 部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | 二级互连 | REACH SVHC | 重量（mg） |
|---|---|---|---|---|---|---|---|
MK20DN512VLQ10(935323298557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e3 | REACH SVHC | 1319.1 |
质量
| 部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度（PPT）（C°） | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| 无铅焊接 | 铅焊接 | 无铅焊接 | 铅焊接 | 无铅焊接 | |||
MK20DN512VLQ10 (935323298557) | No | 3 | 260 | 260 | 40 | 40 | |
配送
| 部件/12NC | 协调关税 (美国)免责声明 | 出口控制分类编号 (美国) |
|---|---|---|
MK20DN512VLQ10 (935323298557) | 854231 | 3A991A2 |
产品变更通知
| 部件/12NC | 发行日期 | 生效日期 | 产品更改通知 | 标题 |
|---|---|---|---|---|
MK20DN512VLQ10 (935323298557) | 2025-04-16 | 2025-05-26 | 202504007I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
MK20DN512VLQ10 (935323298557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
更多信息 K20_100
The Kinetis® K20 100 MHz MCU family offers a scalable portfolio with various levels of integration, featuring a rich suite of analog, communication, timing and control peripherals to accommodate a wide range of requirements.
- Maximizes board space and enhances performance with minimum-length interconnections
- Enables miniaturization of existing applications
- Provides performance efficiency with low power
- Delivers significant BOM savings through smart on-chip integration
- Shares the comprehensive enablement and scalability of the Kinetis portfolio