Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
特点
Kinetis K20: 100MHz Cortex-M4 Performance MCU, 512KB Flash, 128KB SRAM, Full-Speed USB, 100-LQFP
封装
LQFP100: LQFP100, plastic, low profile quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1.4 mm body
购买选项
MK20DN512ZVLL10
不推荐用于新设计
12NC: 935317484557
详细信息
订购
工作特点
| 参数 | 值 |
|---|---|
Security Status | COMPANY PUBLIC |
Description | Kinetis K20: 100MHz Cortex-M4 Performance MCU, 512KB Flash, 128KB SRAM, Full-Speed USB, 100-LQFP |
| 参数 | 值 |
|---|---|
Number of pins | 100 |
Package Style | LQFP |
环境
| 部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | 二级互连 | REACH SVHC | 重量（mg） |
|---|---|---|---|---|---|---|---|
MK20DN512ZVLL10(935317484557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e3 | REACH SVHC | 685.2 |
质量
| 部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度（PPT）（C°） | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| 无铅焊接 | 无铅焊接 | 无铅焊接 | |||||
MK20DN512ZVLL10 (935317484557) | No | 3 | 260 | 40 | |||
配送
| 部件/12NC | 协调关税 (美国)免责声明 | 出口控制分类编号 (美国) | 脚印 | OrCAD Capture符号 |
|---|---|---|---|---|
MK20DN512ZVLL10 (935317484557) | 854231 | 3A991A2 | PDF | Cadence Allegro(dra) | PDF | Orcad Capture 16.3(olb) |
产品变更通知
| 部件/12NC | 发行日期 | 生效日期 | 产品更改通知 | 标题 |
|---|---|---|---|---|
MK20DN512ZVLL10 (935317484557) | 2025-04-16 | 2025-05-26 | 202504007I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
MK20DN512ZVLL10 (935317484557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MK20DN512ZVLL10 (935317484557) | 2020-10-30 | 2020-11-30 | 202007015I | NXP Standardized Tray Attributes for LQFP 14x14 Bulk Shipments |
MK20DN512ZVLL10 (935317484557) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
更多信息 K20_100
The Kinetis® K20 100 MHz MCU family offers a scalable portfolio with various levels of integration, featuring a rich suite of analog, communication, timing and control peripherals to accommodate a wide range of requirements.
- Maximizes board space and enhances performance with minimum-length interconnections
- Enables miniaturization of existing applications
- Provides performance efficiency with low power
- Delivers significant BOM savings through smart on-chip integration
- Shares the comprehensive enablement and scalability of the Kinetis portfolio