FS32R274KSK2MMM 产品信息|NXP

FS32R274KSK2MMM

正常供应

FS32R274KSK2MMM

正常供应

特点


S32R27 multicore Power Architecture, 240 MHz, ISO 26262, AEC-Q100 - S32R MCUs for Radar applications

封装


LFBGA257: LFBGA257, plastic, low profile fine-pitch ball grid array package; 257 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.35 mm body

购买选项

FS32R274KSK2MMM

正常供应

12NC: 935372313557

详细信息

订购

现货:2,509
从分销商处购买

工作特点

参数
Core Type
2 x e200z4, 2 x e200z7
Operating Frequency [Max] (MHz)
240
Flash (kB)
2000
SRAM (kB)
1500
Serial Communication
1 x FlexRay, 1 x LINFlexD, 1 x Zipwire, 2 x I²C, 2 x SPI
I2S
2
CAN
3
Ethernet
1 x 10/100 BaseT
参数
Timers [Number, bits]
16 x 16, 5 x 32
PWM [Number, bits]
12 x 16
ADC [Number, bits]
2 x 12
DAC [Number, bits]
1 x 12
Supply Voltage [Min to Max] (V)
0.95 to 1.5
Ambient Operating Temperature (Min to Max) (℃)
-40 to 125
Junction Temperature (Min to Max) (℃)
-40 to 150
ASIL Certification
up to ASIL D

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
FS32R274KSK2MMM(935372313557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
407.2
FS32R274KSK2MMMR(935372313518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
407.2

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
FS32R274KSK2MMM
(935372313557)
ISO 26262
3
260
40
FS32R274KSK2MMMR
(935372313518)
ISO 26262
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)CCATS
FS32R274KSK2MMM
(935372313557)
854231
5A992C
G175701
FS32R274KSK2MMMR
(935372313518)
854231
5A992C
G175701

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
FS32R274KSK2MMM
(935372313557)
2025-04-162025-05-26202504006IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
FS32R274KSK2MMMR
(935372313518)
FS32R274KSK2MMM
(935372313557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
FS32R274KSK2MMMR
(935372313518)

更多信息 S32R2X

The S32R264 and S32R274 are an AEC-Q100 Grade 1 qualified 32-bit Power Architecture®-based microcontrollers for automotive and industrial high-performance radar applications.

Both S32R264 and S32R274 MCUs address advanced radar signal processing capabilities and merge it with microcontroller capabilities for generic software tasks and car bus interfacing. It meets the high-performance computation demands required by modern beam-forming fast chirp modulation radar systems by offering signal processing acceleration together with powerful multi-core architecture. ​

The S32R264 and S32R274 MCUs offer a >4x leap in performance per power vs. the previous MPC577X products, increasing the level of integration available to designers of next-generation automotive radar modules

更多