AFLP5G25641 产品信息|NXP

特点


Airfast Pre-Driver Module, 2300-2700 MHz, 32 dB, 29 dBm

封装


HLFLGA17: HLFLGA17, thermal enhanced low profile fine-pitch land grid array package, 17 terminals, 0.65 mm pitch, 4 mm x 3 mm x 1.348 mm body

购买选项

工作特点

参数
Frequency (Min) (MHz)
2300
Frequency (Max) (MHz)
2700
参数
Supply Voltage (Typ) (V)
3.3, 5
Die Technology
GaAs

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标REACH SVHC重量(mg)
AFLP5G25641T6(935392181528)
No
Yes
Certificate Of Analysis (CoA)
Yes
HREACH SVHC
38.80199

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
铅焊接铅焊接无铅焊接铅焊接无铅焊接
AFLP5G25641T6
(935392181528)
No
3
260
260
40
40

配送

部件/12NC协调关税 (美国)免责声明
AFLP5G25641T6
(935392181528)
854233

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
AFLP5G25641T6
(935392181528)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label

更多信息 AFLP5G25641

The AFLP5G25641 is an integrated multi-chip module. It consists of three stages of amplification and support circuitry to work at 3.3 V or 5 V with very low power consumption. The amplifier includes a 1.8 V logic control pin for bias enable/disable TDD operation.