NXH2266UK_无线音频和数据流的NFMI无线通讯 | NXP 半导体

安全互联汽车

工业

消费电子

技术

无线音频和数据流的NFMI无线通讯

NXH2266
正常供应

滚动图片以放大

恩智浦® NXH2266是完全集成的单芯片解决方案，采用听力保健行业有着骄人业绩的成熟技术近场磁感应(NFMI)来实现无线音频流和数据通信。

这个超低功耗、单芯片解决方案，采用近场磁感应(NFMI)无线通讯优化无线音频和数据通信，为用户提供一个强大、紧密包含的体域网。

产品详情

特性

主要特性

  • 面向无线音频和数据流传输的单芯片解决方案
  • 面向音频处理的CoolFluxDSP®
  • 可独立工作或与外部MCU一起工作
  • 支持的音频采样频率：16 kHz至48 kHz
  • 封装为凸起芯片 < 7.82 mm²

第二代NFMI技术

  • 低功耗, 稳定耐用, 具有私密性
  • 596 kbit/s传输速率
  • 全球适用
  • 对人体的辐射低

集成式Arm® Cortex®-M0处理器

  • 广泛的外设系列
  • 用户完全可编程

灵活的嵌入式网络

  • 高达15个器件
  • 用于低延迟耳到耳通信的优化协议
  • 多达3个同步音频流

超低功耗操作

  • 双向音频流：1.2 mA时，采样率为16 kHz
  • 单向音频流：1.95 mA时，采样率为48 kHz

由完整的入门套件提供支持

  • 应用电路板
  • LPCXpresso固件环境
  • 软件开发套件

优势

  • 高效、强大和私密性
  • 人体兼容型
  • 用户可编程
  • 灵活的嵌入式网络
  • 允许高集成度
  • 超低功耗操作

更多

购买/参数

2 结果

包含 0 不推荐用于新设计

部件

展开描述

订购

计算机辅助设计模型

状态

预算报价（不含税）

封装类型

Ambient Operating Temperature (Min to Max) (℃)

电源电压[最小]（V）

电源电压[最大]（V）

Power

SNR (dBFS)

Audio Streams

Non-Volatile Memory (kbit)

NXH2266SDK

正常供应

1 @ CNY14360.00

—

—

—

—

—

—

—

—

NXH2266UK

正常供应

10K @ CNY36.83

WLCSP40

-20 to 85

1.15

1.4

3

-93

Up to 3

0

N true 0 PSPNXH2266zh 3 包装信息 Packing Information t935 1 封装信息 Package Information t790 1 简介 Fact Sheet t523 1 zh zh zh 简介 Fact Sheet 1 1 2 English Learn about the many features and benefits of NXP’s ultra-low power, single chip, Near Field Magnetic Induction (NFMI) enabled solutions for high quality wireless audio and data communication. 1565293859646702436251 PSP 158.9 KB None None documents None 1565293859646702436251 /docs/en/fact-sheet/MIGLOFS.pdf 158883 /docs/en/fact-sheet/MIGLOFS.pdf MIGLOFS documents N N 2019-08-08 MiGLO™ NFMI radios for wireless, ultra-low power audio and data streaming /docs/en/fact-sheet/MIGLOFS.pdf /docs/en/fact-sheet/MIGLOFS.pdf Fact Sheet N 736675474163315314 2023-06-18 pdf N en Oct 13, 2021 736675474163315314 Fact Sheet Y N MiGLO™ NFMI radios for wireless, ultra-low power audio and data streaming 封装信息 Package Information 1 2 1.0 English 1506071531302712573633 PSP 498.3 KB None None documents None 1506071531302712573633 /docs/en/package-information/SOT1942-1.pdf 498329 /docs/en/package-information/SOT1942-1.pdf sot1942-1 documents N N 2017-09-22 WLCSP40, wafer level chip-scale package; 40 bumps; 0.4 mm pitch; 2.25 mm x 3.45 mm x 0.525 mm body (backside coating included) /docs/en/package-information/SOT1942-1.pdf /docs/en/package-information/SOT1942-1.pdf Package Information N 302435339416912908 2022-12-07 pdf N en Sep 13, 2017 302435339416912908 Package Information Y N WLCSP40, wafer level chip-scale package; 40 bumps; 0.4 mm pitch; 2.25 mm x 3.45 mm x 0.525 mm body (backside coating included) 包装信息 Packing Information 1 3 1 English 1547653061794707124135 PSP 203.9 KB None None documents None 1547653061794707124135 /docs/en/packing/SOT1942-1.pdf 203896 /docs/en/packing/SOT1942-1.pdf SOT1942-1_PI documents N N 2019-01-16 SOT1942-1 Packing Information /docs/en/packing/SOT1942-1.pdf /docs/en/packing/SOT1942-1.pdf Packing Information N 145666923842250347 2022-12-07 pdf N en Mar 16, 2018 145666923842250347 Packing Information Y N SOT1942-1 Packing Information false 0 NXH2266 downloads zh-Hans true 1 Y PSP Y Y 包装信息 1 /docs/en/packing/SOT1942-1.pdf 2019-01-16 1547653061794707124135 PSP 3 Mar 16, 2018 Packing Information None /docs/en/packing/SOT1942-1.pdf English documents 203896 None 145666923842250347 2022-12-07 N /docs/en/packing/SOT1942-1.pdf SOT1942-1 Packing Information /docs/en/packing/SOT1942-1.pdf documents 145666923842250347 Packing Information N en None Y pdf 1 N N SOT1942-1 Packing Information 203.9 KB SOT1942-1_PI N 1547653061794707124135 封装信息 1 /docs/en/package-information/SOT1942-1.pdf 2017-09-22 1506071531302712573633 PSP 2 Sep 13, 2017 Package Information None /docs/en/package-information/SOT1942-1.pdf English documents 498329 None 302435339416912908 2022-12-07 N /docs/en/package-information/SOT1942-1.pdf WLCSP40, wafer level chip-scale package; 40 bumps; 0.4 mm pitch; 2.25 mm x 3.45 mm x 0.525 mm body (backside coating included) /docs/en/package-information/SOT1942-1.pdf documents 302435339416912908 Package Information N en None Y pdf 1.0 N N WLCSP40, wafer level chip-scale package; 40 bumps; 0.4 mm pitch; 2.25 mm x 3.45 mm x 0.525 mm body (backside coating included) 498.3 KB sot1942-1 N 1506071531302712573633 简介 1 /docs/en/fact-sheet/MIGLOFS.pdf 2019-08-08 1565293859646702436251 PSP 1 Oct 13, 2021 Fact Sheet Learn about the many features and benefits of NXP’s ultra-low power, single chip, Near Field Magnetic Induction (NFMI) enabled solutions for high quality wireless audio and data communication. None /docs/en/fact-sheet/MIGLOFS.pdf English documents 158883 None 736675474163315314 2023-06-18 N /docs/en/fact-sheet/MIGLOFS.pdf MiGLO™ NFMI radios for wireless, ultra-low power audio and data streaming /docs/en/fact-sheet/MIGLOFS.pdf documents 736675474163315314 Fact Sheet N en None Y pdf 2 N N MiGLO™ NFMI radios for wireless, ultra-low power audio and data streaming 158.9 KB MIGLOFS N 1565293859646702436251 true Y Products

文档

快速参考恩智浦 文档类别.

筛选条件

3 文件

紧凑列表

设计文件

软件

快速参考恩智浦 软件类型.

筛选条件

支持

您需要什么帮助?

  • Narrow your search
搜索