无线音频和数据流的NFMI无线电 | NXP 半导体

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无线音频和数据流的NFMI无线电

NXH2261UK 正常供应

滚动图片以放大

恩智浦NxH2261是完全集成的单芯片解决方案，采用听力保健行业有着骄人业绩的成熟技术近场磁感应(NFMI)来实现无线音频流和数据通信。

这个超低功耗、单芯片解决方案，采用近场磁感应(NFMI)无线电优化无线音频和数据通信，为用户提供一个强大、紧密包含的体域网。

产品详情

特征

  • 面向无线音频和数据流传输的单芯片解决方案
  • 第二代NFMI技术
    • 低功耗, 稳定耐用, 具有私密性
    • 596 kbit/s传输速率
    • 全球适用
    • 对人体的辐射低
  • 集成式ARM Cortex-M0处理器
    • 广泛的外设系列
    • 用户完全可编程
  • 面向音频处理的CoolFlux DSP
  • 可独立工作或与外部MCU一起工作
  • 灵活的嵌入式网络
    • 最高15个设备
    • 用于低延迟耳到耳通信的优化协议
    • 最多两个音频Tx，两个音频Rx和多个并行数据流
  • 支持的音频采样频率：16 kHz至48 kHz
  • 超低功耗操作
    • 双向音频流：1.2 mA时，采样率为16 kHz
    • 单向音频流：1.95 mA时，采样率为48 kHz
  • 封装为凸起芯片 < 11 mm²
  • 采用单块ZnAir电池来操作
  • 由完整的入门套件提供支持
    • 应用电路板
    • LPCXpresso固件环境
    • 软件开发套件
  • 高效、强大和私密性
  • 人体兼容型
  • 用户可编程
  • 灵活的嵌入式网络
  • 允许高集成度
  • 超低功耗操作

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N true 0 PSPNXH2261UKzh 3 包装信息 Packing Information t935 1 封装信息 Package Information t790 1 简介 Fact Sheet t523 1 zh zh zh 简介 Fact Sheet 1 1 2 English Learn about the many features and benefits of NXP’s ultra-low power, single chip, Near Field Magnetic Induction (NFMI) enabled solutions for high quality wireless audio and data communication. 1565293859646702436251 PSP 158.9 KB None None documents None 1565293859646702436251 /docs/en/fact-sheet/MIGLOFS.pdf 158883 /docs/en/fact-sheet/MIGLOFS.pdf MIGLOFS documents N N 2019-08-08 MiGLO™ NFMI radios for wireless, ultra-low power audio and data streaming /docs/en/fact-sheet/MIGLOFS.pdf /docs/en/fact-sheet/MIGLOFS.pdf Fact Sheet N 736675474163315314 2023-06-18 pdf N en Oct 13, 2021 736675474163315314 Fact Sheet Y N MiGLO™ NFMI radios for wireless, ultra-low power audio and data streaming 封装信息 Package Information 1 2 1.0 English 1476247164101717932787 PSP 528.0 KB None None documents None 1476247164101717932787 /docs/en/package-information/SOT1887-1.pdf 528000 /docs/en/package-information/SOT1887-1.pdf SOT1887-1 documents N N 2016-10-11 wafer level chip-scale package; 48 bumps; 3.72 mm x 2.79 mm x 0.525 mm(Backside coating included) /docs/en/package-information/SOT1887-1.pdf /docs/en/package-information/SOT1887-1.pdf Package Information N 302435339416912908 Y 2022-12-07 PDF en Oct 7, 2016 302435339416912908 Package Information 528.0 KB N /docs/en/package-information/SOT1887-1.pdf wafer level chip-scale package; 48 bumps; 3.72 mm x 2.79 mm x 0.525 mm(Backside coating included) 包装信息 Packing Information 1 3 kb 1.0 English 1480488030238705828231 PSP 201.0 KB None None documents None 1480488030238705828231 /docs/en/packing/SOT1887-1_012.pdf 201000 /docs/en/packing/SOT1887-1_012.pdf SOT1887-1_012 documents N N 2016-11-29 WLCSP48; Reel dry pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending ,012 or Z Ordering code (12NC) ending 012 /docs/en/packing/SOT1887-1_012.pdf /docs/en/packing/SOT1887-1_012.pdf Packing Information N 145666923842250347 Y 2022-12-07 PDF en Nov 29, 2016 145666923842250347 Packing Information 201.0 MB N /docs/en/packing/SOT1887-1_012.pdf WLCSP48; Reel dry pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending ,012 or Z Ordering code (12NC) ending 012 PDF false 0 NXH2261UK downloads zh-Hans true 1 Y PSP Y Y 包装信息 1 /docs/en/packing/SOT1887-1_012.pdf 2016-11-29 1480488030238705828231 PSP 3 Nov 29, 2016 Packing Information PDF None /docs/en/packing/SOT1887-1_012.pdf English documents 201000 kb None 145666923842250347 2022-12-07 /docs/en/packing/SOT1887-1_012.pdf WLCSP48; Reel dry pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending ,012 or Z Ordering code (12NC) ending 012 /docs/en/packing/SOT1887-1_012.pdf documents 145666923842250347 Packing Information N en None N PDF 1.0 N WLCSP48; Reel dry pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending ,012 or Z Ordering code (12NC) ending 012 Y 201.0 KB 201.0 MB SOT1887-1_012 N /docs/en/packing/SOT1887-1_012.pdf 1480488030238705828231 封装信息 1 /docs/en/package-information/SOT1887-1.pdf 2016-10-11 1476247164101717932787 PSP 2 Oct 7, 2016 Package Information None /docs/en/package-information/SOT1887-1.pdf English documents 528000 None 302435339416912908 2022-12-07 /docs/en/package-information/SOT1887-1.pdf wafer level chip-scale package; 48 bumps; 3.72 mm x 2.79 mm x 0.525 mm(Backside coating included) /docs/en/package-information/SOT1887-1.pdf documents 302435339416912908 Package Information N en None N PDF 1.0 N wafer level chip-scale package; 48 bumps; 3.72 mm x 2.79 mm x 0.525 mm(Backside coating included) Y 528.0 KB 528.0 KB SOT1887-1 N /docs/en/package-information/SOT1887-1.pdf 1476247164101717932787 简介 1 /docs/en/fact-sheet/MIGLOFS.pdf 2019-08-08 1565293859646702436251 PSP 1 Oct 13, 2021 Fact Sheet Learn about the many features and benefits of NXP’s ultra-low power, single chip, Near Field Magnetic Induction (NFMI) enabled solutions for high quality wireless audio and data communication. None /docs/en/fact-sheet/MIGLOFS.pdf English documents 158883 None 736675474163315314 2023-06-18 N /docs/en/fact-sheet/MIGLOFS.pdf MiGLO™ NFMI radios for wireless, ultra-low power audio and data streaming /docs/en/fact-sheet/MIGLOFS.pdf documents 736675474163315314 Fact Sheet N en None Y pdf 2 N N MiGLO™ NFMI radios for wireless, ultra-low power audio and data streaming 158.9 KB MIGLOFS N 1565293859646702436251 true Y Products

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