低功耗IC卡接口 | NXP 半导体

低功耗IC卡接口

查看产品图片

产品详情

特征

  • I²C总线控制型IC卡接口采用TSSOP28封装
  • 电源电压:2.7 V至6.5 V
  • 独立电源电压VDD(INTF)可用于微控制器的信号接口
  • 器件不工作时可提供关断输入,具有极低的功耗
  • 卡片激活时提供低功耗模式
  • DC-DC转换器用来生成VCC(根据电源电压和卡片电压自动选择容性倍频器、三倍器、电感或跟随器)
  • 一条受专门保护的半双工双向缓冲I/O线,限流为+-15 mA,最大频率为1 MHz
  • 两条副卡I/O线,由I²C总线(C4和C8)控制
  • VCC调节:5 V、3 V或1.8 V +- 8%,ICC< 55 mA,电流尖峰为40 nAs(最高20 MHz),上升和下降时间受控,滤波过载检测约为80 mA,限流约为120 mA
  • 针对所有卡片接触的热保护和短路保护
  • 自动激活与取消激活序列:发生短路、卡片移走、过热、VDD或VDD(DCDC)下降等事件时,可通过软件或硬件初始化
  • 卡片端具有增强静电放电(ESD)保护功能(> 6 kV)
  • 20 MHz时钟输入
  • 卡片的时钟生成频率高达10 MHz(CLKIN 1/2/4/5分频),具有同步频率变化;高电平或低电平停止,或以1 MHz在卡片低功耗模式下自由运行;针脚CLK (C3)具有限流功能
  • RST信号(C2)限流为20 mA,由异步卡上的嵌入式可编程CLK脉冲计数器控制,或由同步卡上的寄存器控制
  • 兼容ISO 7816-3、GSM 11.11和EMV 2000(支付系统)
  • 电源电压监控器用于上电尖峰消除和关断时的紧急取消激活;阈值内部固定或通过外部电阻桥进行设置;脉冲宽度内部固定或通过外部电容进行设置
  • 内置10 ms去抖系统的卡片存在性输入
  • 一个中断信号INT

Target Applications

  • 银行终端
  • 互联网终端
  • 机顶盒
  • 便携式IC卡读卡器
N true 0 PSPTDA8023TTzh 6 包装信息 Packing Information t935 1 封装信息 Package Information t790 1 应用笔记 Application Note t789 1 支持信息 Supporting Information t531 1 数据手册 Data Sheet t520 1 用户指南 User Guide t792 1 zh 0 false zh zh 数据手册 Data Sheet 1 1 2.0 English 1442069102123692983279 PSP 206.0 KB None None documents None 1442069102123692983279 /docs/en/data-sheet/TDA8023.pdf 206000 /docs/en/data-sheet/TDA8023.pdf TDA8023 documents N 2015-09-12 Low power IC card interface /docs/en/data-sheet/TDA8023.pdf /docs/en/data-sheet/TDA8023.pdf Data Sheet N 980000996212993340 2022-12-07 pdf en Jun 30, 2016 980000996212993340 Data Sheet Y N Low power IC card interface 应用笔记 Application Note 1 2 1.1 English 1442087436301695658782 PSP 1.9 MB None None documents None 1442087436301695658782 /docs/en/application-note/AN11079.pdf 1874070 /docs/en/application-note/AN11079.pdf AN11079 documents N N 2016-07-13 Contact reader ICs - TDA product support packages /docs/en/application-note/AN11079.pdf /docs/en/application-note/AN11079.pdf Application Note N 645036621402383989 2022-12-07 pdf N en Mar 6, 2015 645036621402383989 Application Note Y N Contact reader ICs - TDA product support packages 用户指南 User Guide 1 3 1.0 English 1442125533209710359206 PSP 1.2 MB None None documents None 1442125533209710359206 /docs/en/user-guide/UM10349.pdf 1190622 /docs/en/user-guide/UM10349.pdf UM10349 documents N N 2016-10-08 Contact smart card reader chips evaluation with CAKE80xx_MBA /docs/en/user-guide/UM10349.pdf /docs/en/user-guide/UM10349.pdf User Guide N 132339537837198660 2022-12-07 pdf N en Oct 16, 2014 132339537837198660 User Guide Y N Contact smart card reader chips evaluation with CAKE80xx_MBA 封装信息 Package Information 1 4 1.0 English 1455079535791698867422 PSP 383.7 KB None None documents None 1455079535791698867422 /docs/en/package-information/SOT361-1.pdf 383703 /docs/en/package-information/SOT361-1.pdf SOT361-1 documents N N 2016-02-12 plastic thin shrink small outline package; 28 leads; body width 4.4 mm /docs/en/package-information/SOT361-1.pdf /docs/en/package-information/SOT361-1.pdf Package Information N 302435339416912908 2024-10-21 pdf N en Feb 8, 2016 302435339416912908 Package Information Y N plastic thin shrink small outline package; 28 leads; body width 4.4 mm 包装信息 Packing Information 1 5 3.0 English 1442131463535720088921 PSP 232.6 KB None None documents None 1442131463535720088921 /docs/en/packing/SOT361-1_118.pdf 232565 /docs/en/packing/SOT361-1_118.pdf SOT361-1_118 documents N N 2013-04-17 TSSOP28; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code (12NC) ending 118 /docs/en/packing/SOT361-1_118.pdf /docs/en/packing/SOT361-1_118.pdf Packing Information N 145666923842250347 2024-10-21 pdf N en Apr 16, 2013 145666923842250347 Packing Information Y N TSSOP28; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code (12NC) ending 118 支持信息 Supporting Information 1 6 1.0 English SSOP, TSSOP & VSO FOOTPRINT (WAVE SOLDERING) 1442126381432716559822 PSP 16.6 KB None None documents None 1442126381432716559822 /docs/en/supporting-information/SSOP-TSSOP-VSO-WAVE.pdf 16645 /docs/en/supporting-information/SSOP-TSSOP-VSO-WAVE.pdf SSOP-TSSOP-VSO-WAVE documents N N 2016-10-08 Footprint for wave soldering /docs/en/supporting-information/SSOP-TSSOP-VSO-WAVE.pdf /docs/en/supporting-information/SSOP-TSSOP-VSO-WAVE.pdf Supporting Information N 371282830530968666 2024-10-21 pdf N en Oct 8, 2009 371282830530968666 Supporting Information Y N Footprint for wave soldering false 0 TDA8023TT downloads zh-Hans true 1 Y PSP 包装信息 1 /docs/en/packing/SOT361-1_118.pdf 2013-04-17 1442131463535720088921 PSP 5 Apr 16, 2013 Packing Information None /docs/en/packing/SOT361-1_118.pdf English documents 232565 None 145666923842250347 2024-10-21 N /docs/en/packing/SOT361-1_118.pdf TSSOP28; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code (12NC) ending 118 /docs/en/packing/SOT361-1_118.pdf documents 145666923842250347 Packing Information N en None Y pdf 3.0 N N TSSOP28; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code (12NC) ending 118 232.6 KB SOT361-1_118 N 1442131463535720088921 封装信息 1 /docs/en/package-information/SOT361-1.pdf 2016-02-12 1455079535791698867422 PSP 4 Feb 8, 2016 Package Information None /docs/en/package-information/SOT361-1.pdf English documents 383703 None 302435339416912908 2024-10-21 N /docs/en/package-information/SOT361-1.pdf plastic thin shrink small outline package; 28 leads; body width 4.4 mm /docs/en/package-information/SOT361-1.pdf documents 302435339416912908 Package Information N en None Y pdf 1.0 N N plastic thin shrink small outline package; 28 leads; body width 4.4 mm 383.7 KB SOT361-1 N 1455079535791698867422 应用笔记 1 /docs/en/application-note/AN11079.pdf 2016-07-13 1442087436301695658782 PSP 2 Mar 6, 2015 Application Note None /docs/en/application-note/AN11079.pdf English documents 1874070 None 645036621402383989 2022-12-07 N /docs/en/application-note/AN11079.pdf Contact reader ICs - TDA product support packages /docs/en/application-note/AN11079.pdf documents 645036621402383989 Application Note N en None Y pdf 1.1 N N Contact reader ICs - TDA product support packages 1.9 MB AN11079 N 1442087436301695658782 支持信息 1 /docs/en/supporting-information/SSOP-TSSOP-VSO-WAVE.pdf 2016-10-08 1442126381432716559822 PSP 6 Oct 8, 2009 Supporting Information SSOP, TSSOP & VSO FOOTPRINT (WAVE SOLDERING) None /docs/en/supporting-information/SSOP-TSSOP-VSO-WAVE.pdf English documents 16645 None 371282830530968666 2024-10-21 N /docs/en/supporting-information/SSOP-TSSOP-VSO-WAVE.pdf Footprint for wave soldering /docs/en/supporting-information/SSOP-TSSOP-VSO-WAVE.pdf documents 371282830530968666 Supporting Information N en None Y pdf 1.0 N N Footprint for wave soldering 16.6 KB SSOP-TSSOP-VSO-WAVE N 1442126381432716559822 数据手册 1 /docs/en/data-sheet/TDA8023.pdf 2015-09-12 1442069102123692983279 PSP 1 Jun 30, 2016 Data Sheet None /docs/en/data-sheet/TDA8023.pdf English documents 206000 None 980000996212993340 2022-12-07 /docs/en/data-sheet/TDA8023.pdf Low power IC card interface /docs/en/data-sheet/TDA8023.pdf documents 980000996212993340 Data Sheet N en None Y pdf 2.0 N Low power IC card interface 206.0 KB TDA8023 N 1442069102123692983279 用户指南 1 /docs/en/user-guide/UM10349.pdf 2016-10-08 1442125533209710359206 PSP 3 Oct 16, 2014 User Guide None /docs/en/user-guide/UM10349.pdf English documents 1190622 None 132339537837198660 2022-12-07 N /docs/en/user-guide/UM10349.pdf Contact smart card reader chips evaluation with CAKE80xx_MBA /docs/en/user-guide/UM10349.pdf documents 132339537837198660 User Guide N en None Y pdf 1.0 N N Contact smart card reader chips evaluation with CAKE80xx_MBA 1.2 MB UM10349 N 1442125533209710359206 true Y Products

文档

快速参考恩智浦 文档类别.

6 文件

紧凑列表

包装信息 (1)
封装信息 (1)
应用笔记 (1)
支持信息 (1)
数据手册 (1)
用户指南 (1)

培训

3 培训

要查找支持该产品的其他合作伙伴产品,请访问我们的 合作伙伴市场.

支持

您需要什么帮助?

近期查看的产品

There are no recently viewed products to display.

查看或编辑浏览历史