封装信息 (1)
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Wire bond die; 248 bonding pads[OL-PCF8531U]
应用笔记 (3)
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ESD and EMC sensitivity of IC[AN10853]
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Handling bare die[AN10706]
手册 (3)
数据手册 (1)
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34 x 128 pixel matrix driver[PCF8531]
用户指南 (2)
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PCA9632 demonstration board OM13269[UM10528]