封装信息 (2) plastic low profile fine-pitch ball grid array package; 170 balls[SOT1315-1] PDFJun 8, 2016版本更新 1.2 plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad[SOT612-4] PDFJun 8, 2016版本更新 1.0 数据手册 (1) Terrestrial digital radio processor[SAF3560_SDS] PDFMay 22, 2013版本更新 5.0 该选项下未搜到结果。
封装信息 (2) plastic low profile fine-pitch ball grid array package; 170 balls[SOT1315-1] PDFJun 8, 2016版本更新 1.2 plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad[SOT612-4] PDFJun 8, 2016版本更新 1.0 数据手册 (1) Terrestrial digital radio processor[SAF3560_SDS] PDFMay 22, 2013版本更新 5.0