201808025F01 : IMPROVED PASSIVE COMPONENT ATTACH MATERIAL FOR TO270WB PACKAGES
NXP announces a change from silver filled epoxy to a sintered silver die attach for passive components in TO270WB packages. Sintered silver is a widely accepted die attach material for power devices with superior thermal and electrical properties and significantly increases the adhesion strength of the bond between passive component and heatsink. Datasheet Functional Table RF performance specifications remains unchanged. If you have any questions or require additional information please contact your local NXP sales office or NXP approved distributor.
| PCN类型 | 更改类别 | 发行日期 | 生效日期 |
|---|---|---|---|
| Final Product Change Notification | Assembly materials | 22-Feb-2019 | 22-May-2019 |
变化的原因
Die attach material standardization and improved die attach bond strength.
受影响产品的识别
Device marking will not change.
预期的影响
数据表的修订: No impact to existing datasheet
No impact on form fit function reliability or quality.
受影响的部分
| 零件号/ 12NC | 上次购买日期 | 上次交货日期 | 备件 |
|---|---|---|---|
|
A2I20D020GNR1 (935313109528) |
- | - | - |
|
A2I20D020NR1 (935313237528) |
- | - | - |
|
A2I20D040GNR1 (935316286528) |
- | - | - |
|
A2I20D040NR1 (935316291528) |
- | - | - |
|
A2I22D050NR1 (935312142528) |
- | - | - |
|
A2I25D025GNR1 (935323756528) |
- | - | - |
|
A2I25D025NR1 (935315964528) |
- | - | - |
|
A2I25H060GNR1 (935316196528) |
- | - | - |
|
A2I25H060NR1 (935322312528) |
- | - | - |
|
A2I35H060NR1 (935322497528) |
- | - | - |
|
A2T09VD250NR1 (935320819528) |
- | - | - |
|
A2T09VD300NR1 (935316219528) |
- | - | - |
|
AFIC31025GNR1 (935343961528) |
- | - | - |
|
AFIC31025NR1 (935343962528) |
- | - | - |