Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
封装
LQFP64: LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body
购买选项
SC56F8037F4VLH
正常供应
12NC: 935325515557
详细信息
订购
工作特点
| 参数 | 值 |
|---|---|
Flash (kB) | 64 |
RAM (kB) | 8 |
Operating Frequency [Max] (MHz) | 32 |
CAN | 1 |
| 参数 | 值 |
|---|---|
I2C | 1 |
SPI | 2 |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 125 |
环境
| 部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | 二级互连 | REACH SVHC | 重量（mg） |
|---|---|---|---|---|---|---|---|
SC56F8037F4VLH(935325515557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e3 | REACH SVHC | 346.55 |
质量
| 部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度（PPT）（C°） | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| 无铅焊接 | 无铅焊接 | 无铅焊接 | |||||
SC56F8037F4VLH (935325515557) | No | 3 | 260 | 40 | |||
配送
| 部件/12NC | 协调关税 (美国)免责声明 | 出口控制分类编号 (美国) |
|---|---|---|
SC56F8037F4VLH (935325515557) | 854231 | 3A991A2 |
产品变更通知
| 部件/12NC | 发行日期 | 生效日期 | 产品更改通知 | 标题 |
|---|---|---|---|---|
SC56F8037F4VLH (935325515557) | 2025-04-16 | 2025-05-26 | 202504009I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
SC56F8037F4VLH (935325515557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
SC56F8037F4VLH (935325515557) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
更多信息 56F803X
NXP® 56F803X digital signal controllers belong to the 56800E core-based DSC family. It combines digital signal processing and microcontroller functionalities on a single chip, with a flexible set of peripherals.
- Supports industrial and motor control, home appliances, inverters, smart sensors, fire and security systems, switched-mode power supply, power management, and medical monitoring
- On-chip integration and ease of implementation help to speed development, lower component count, and significantly reduce system cost
- Supported by robust development tools to simplify and accelerate time-to-market