MPC566CZP56 产品信息|NXP

特点


NXP 32-bit MCU, Power Arch core, 1MB Flash, 56MHz, -40/+85degC, Automotive Grade, PBGA 388

封装


BGA388: BGA388, plastic ball grid array package; 388 balls; 1 mm pitch; 27 mm x 27 mm x 1.95 mm body

购买选项

MPC566CZP56

使用寿命终止

12NC: 935309526557

详细信息

订购

从分销商处购买

工作特点

参数
Security Status
COMPANY PUBLIC
Description
NXP 32-bit MCU, Power Arch core, 1MB Flash, 56MHz, -40/+85degC, Automotive Grade, PBGA 388
参数
Number of pins
388
Package Style
BGA

环境

部件/12NC无铅欧盟 RoHSRHF指标二级互连REACH SVHC重量(mg)
MPC566CZP56(935309526557)
No
No
N
e0
REACH SVHC
2450.85

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
铅焊接铅焊接铅焊接
MPC566CZP56
(935309526557)
No
3
240
30

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
MPC566CZP56
(935309526557)
854231
3A991A2

停产和更换部件数据

部件/12NC停产通知替代器件
MPC566CZP56
(935309526557)
-
MPC566CVR56
(935319143557)

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
MPC566CZP56
(935309526557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MPC566CZP56
(935309526557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

更多信息 MPC566

The MPC566 integrates a Power Architecture® core with a dual precision floating point unit and BCC, 36 KB of RAM and 1 MB of flash memory.

The MPC566, an upgraded version of the MPC565, offers code compression to enable more efficient use of internal or external flash memory. Code compression is optimized for automotive (non-cached) applications and the new scheme increases performance by 40 to 50 percent.