MIMXRT685SFAWB 产品信息|NXP

特点


i.MX RT600 Crossover MCU with Arm® Cortex®-M33 and DSP Cores

封装


WLCSP114: WLCSP114, wafer level chip scale package, 114 terminals, 0.35 mm pitch, 4.235 mm x 4.235 mm x 0.49 mm body (backside coating included)

购买选项

MIMXRT685SFAWBR

正常供应

12NC: 935405912019

详细信息

数量

单价

1 - 25$6.14
26 - 99$5.66
100+$5.19

订购

$6.14 USD
现货:5,715
从分销商处购买

工作特点

参数
Core: Number of cores (SPEC)
2
Core Type
Arm Cortex-M33
Operating Frequency [Max] (MHz)
300
SRAM (kB)
4608
External Memory Supported
FlexSPI, NOR FLASH
FlexComm (UART/I2C/SPI/I2S)
7
参数
USB Controllers
1
Security
AES-D, CA, CRC, HAB, SNVS, TRNG
PWM
5
ADC [Number, bits]
1 x 12
Supply Voltage [Min to Max] (V)
1.71 to 3.6
Ambient Operating Temperature (Min to Max) (℃)
-20 to 85

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标REACH SVHC重量(mg)
MIMXRT685SFAWBR(935405912019)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
17.98644393

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
MIMXRT685SFAWBR
(935405912019)
No
1
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)CCATS
MIMXRT685SFAWBR
(935405912019)
854231
5A992C
G179345

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
MIMXRT685SFAWBR
(935405912019)
2024-12-202024-12-21202411016Ii.MX RT600 Errata Update

更多信息 i.MX-RT600

i.MX RT600 Crossover MCUs are dual-core devices featuring an Arm® Cortex®-M33 and Cadence® Xtensa® HiFi4 Audio DSP CPU designed for audio, voice and consumer IoT applications.

The i.MX RT600 Arm® Cortex®-M33 operates at up to 300 MHz and includes two coprocessors providing enhanced performance. The HiFi4 can operate up to 600 MHz. The family offers a rich set of peripherals, embedded security and very low power consumption. The device has up to 4.5 MB SRAM and a FlexSPI with two ports and 32 KB cache.

The i.MX RT600 family is supported by the MCUXpresso ecosystem, which includes an SDK, a choice of IDEs and secure provisioning and configuration tools to enable rapid development.

更多