Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
封装
LFBGA196: LFBGA196, plastic, low profile fine-pitch ball grid array; 196 balls; 0.65 mm pitch; 10 mm x 10 mm x 1.3 mm body
购买选项
MIMXRT106LDVL6B
正常供应
12NC: 935399821557
详细信息
数量
单价
| 1 - 25 | $8.93 |
| 26 - 99 | $8.24 |
| 100+ | $7.56 |
订购
现货:480
从分销商处购买工作特点
| 参数 | 值 |
|---|---|
Core: Number of cores (SPEC) | 1 |
Core Type | Arm Cortex-M7 |
Operating Frequency [Max] (MHz) | 600 |
SRAM (kB) | 1024 |
CAN | 2 |
| 参数 | 值 |
|---|---|
I2C | 4 |
UART | 8 |
USB Controllers | 2 |
Junction Temperature (Min to Max) (℃) | 0 to 95 |
环境
| 部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | REACH SVHC | 重量（mg） |
|---|---|---|---|---|---|---|
MIMXRT106LDVL6B(935399821557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | REACH SVHC | 250.6 |
质量
| 部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度（PPT）（C°） | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| 无铅焊接 | 无铅焊接 | 无铅焊接 | |||||
MIMXRT106LDVL6B (935399821557) | No | 3 | 260 | 40 | |||
配送
| 部件/12NC | 协调关税 (美国)免责声明 | 出口控制分类编号 (美国) | CCATS |
|---|---|---|---|
MIMXRT106LDVL6B (935399821557) | 854231 | 5A992C | G175675 |
产品变更通知
| 部件/12NC | 发行日期 | 生效日期 | 产品更改通知 | 标题 |
|---|---|---|---|---|
MIMXRT106LDVL6B (935399821557) | 2021-12-22 | 2021-12-23 | 202111017I | i.MX RT1024 Errata Rev 2 i.MX RT1050 Errata Rev 3 i.MX RT1010 Errata Rev 1 i.MX RT1060/RT1064 Silicon A Errata Rev 1.3 and i.MX RT1060/RT1064 Silicon B Errata Rev 1.1 Updates |
MIMXRT106LDVL6B (935399821557) | 2021-11-25 | 2021-11-26 | 202109002I | i.MXRT1060 Reference Manual Rev 3 i.MXRT1064 Reference Manual Rev 2 and i.MXRT1050 Reference Manual Rev 5 Updates |
MIMXRT106LDVL6B (935399821557) | 2021-05-08 | 2021-05-09 | 202104017I | i.MX RT1015/RT1020/RT1050/RT1060 Data Sheet Rev 2 Update i.MX RT1024 Data Sheet Rev 1 Update and i.MX RT1064 Data Sheet Rev 3 Update |
MIMXRT106LDVL6B (935399821557) | 2020-11-08 | 2020-11-09 | 202010024I | i.MXRT1060/i.MXRT1064 Chip Errata Rev 1.2 Update for 0N00X and Release Errata Rev1.0 for 1N00X |
MIMXRT106LDVL6B (935399821557) | 2020-08-12 | 2020-08-13 | 202007036I | i.MX RT1060 Data Sheet IMXRT1060CEC/IEC Update to Rev 1 |
MIMXRT106LDVL6B (935399821557) | 2020-04-24 | 2020-05-25 | 202004014I | i.MXRT1050 / RT1060 / RT106A / RT1064 10x10 196MAPBGA Final Test Site Expansion from NXP-ATTJ to ASECL |
更多信息 i.MX-RT1060
i.MX RT1060 Crossover MCUs are based on the Arm®Cortex®-M7 core for real-time microcontroller performance and high integration for industrial and IoT applications.
The i.MX RT1060 Arm®Cortex®-M7 operates at up to 600 MHz with 1 MB on-chip RAM. The family offers 2D graphics, camera, various memory interfaces and a wide range of connectivity interfaces including UART, SPI, I²C, USB, 2x 10/100M Ethernet, and 3x CAN. Additional features for real-time applications include high-speed GPIO, CAN FD and synchronous parallel NAND/NOR/PSRAM controller. The i.MX RT1060 provides additional flexibility with 225BGA, 196BGA packages and an extended temperature range of up to 125°C.
The i.MX RT1060 family is supported by the MCUXpresso ecosystem, which includes an SDK, a choice of IDEs and secure provisioning and configuration tools to enable rapid development.