MCF5307AI66B 产品信息|NXP

MCF5307AI66B

使用寿命终止

MCF5307AI66B

使用寿命终止

特点


MCF5307 V3CORE 4KSRAM

封装


QFP208: QFP208, plastic, quad flat package; 208 terminals; 0.5 mm pitch; 28 mm x 28 mm x 4.1 mm body

购买选项

MCF5307AI66B

使用寿命终止

12NC: 935324043557

详细信息

订购

从分销商处购买

工作特点

参数
Security Status
COMPANY PUBLIC
Description
MCF5307 V3CORE 4KSRAM
参数
Number of pins
208
Package Style
QFP

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
MCF5307AI66B(935324043557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
5696.45

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
MCF5307AI66B
(935324043557)
No
3
250
30

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
MCF5307AI66B
(935324043557)
854231
3A991A2

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
MCF5307AI66B
(935324043557)
2025-04-162025-05-26202504007IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MCF5307AI66B
(935324043557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label

更多信息 MCF530X

The MCF5307 is a high-performance (70 MIPS), cost-effective, highly integrated microprocessor designed for embedded control applications. The MCF5307 combines a ColdFire® V3; processor core with a multiply-accumulate (MAC) module, DRAM controller, direct memory access (DMA) controller, timers and parallel and serial interfaces. The time required for system design and implementation is greatly reduced by packaging common system functions on-chip and providing glueless interfaces to 8- 16- and 32-bit DRAM, SRAM, ROM and I/O devices.