MC13213 产品信息|NXP

特点


SIP 802.15.4 2.4GHZ 60KB

封装


HVLGA71: HVLGA71, plastic, thermal enhanced, very thin, low profile land grid array package; 71 balls; 0.5 mm pitch; 9 mm x 9 mm x 0.9 mm body

购买选项

MC13213

使用寿命终止

12NC: 935313422557

详细信息

订购

从分销商处购买

工作特点

参数
Security Status
COMPANY PUBLIC
Description
SIP 802.15.4 2.4GHZ 60KB
参数
Number of pins
71
Package Style
HVLGA

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标REACH SVHC重量(mg)
MC13213(935313422557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
159.9
MC13213R2(935313422518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
159.9

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
MC13213
(935313422557)
No
3
250
30
MC13213R2
(935313422518)
No
3
250
30

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
MC13213
(935313422557)
854231
3A991A2
MC13213R2
(935313422518)
854231
3A991A2

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
MC13213
(935313422557)
2025-04-162025-05-26202504006IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MC13213R2
(935313422518)
MC13213
(935313422557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MC13213R2
(935313422518)
MC13213
(935313422557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments
MC13213R2
(935313422518)

更多信息 MC13213

Archived content is no longer updated and is made available for historical reference only.

Please note that this product is not recommended for new designs.

The MC13213 System in Package (SiP) integrates the MC9S08GT MCU with the MC1320x transceiver into a single 9x9mm LGA package.  The MC13213 provides 60 K Flash memory and 4 K of RAM.  By using the IEEE 802.15.4 Compliant MAC, or BeeStack® ZigBee Protocol Stack, the MC13213 is an ideal solution for sensing and control applications that require mesh networking.