SOT1750-1: HVLGA71


概述

HVLGA71, plastic, thermal enhanced, very thin, low profile land grid array package; 71 balls; 0.5 mm pitch; 9 mm x 9 mm x 0.9 mm body
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
HVLGA71 surface mount bottom HVLGA 9 x 9 x 0.9 71 plastic
生产代码 Reference Codes Issue Date
98ASA10674D PBMA-N71(JEDEC 2017-06-11
部分 描述 Quick access
SIP 802.15.4 2.4GHZ 60KB
SIP 802.15.4 2.4GHZ 16KB
SIP 802.15.4 2.4GHZ 32KB