SOT616-3: HVQFN24


概述

plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
HVQFN24 surface mount quad HVQFN 4 x 4 x 0.85 24 plastic
生产代码 Reference Codes Issue Date
SOT616 MO-220(JEDEC 2015-02-19
部分 描述 Quick access
Low-voltage translating 14-bit SPI I/O expander
16kB flash, 2kB SRAM, ADC, HVQFN24 package
Dual supply 1-of-2 VGA switch
5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs
Scalable Entry Level 32-bit Microcontroller (MCU) based on ARM Cortex-M0+/M0 Cores
Dual Channel, SuperSpeed USB 3.0
Low-voltage translating 14-bit SPI I/O expander - AEC_Q100 compliant
16kB flash, 4kB SRAM, HVQFN24 package
Single UART with I2C-bus/SPI interface, 64 bytes of transmit and receive FIFOs, IrDA SIR built-in support
8-bit I/O expander with I2C-bus/SPI interface
SPI to I2C-bus interface
Transmitter IQ modulator
Low-Cost Microcontrollers (MCUs) based on Arm® Cortex®M0+ Cores with NFC
Therapy adherence monitor
Single UART with I2C-bus/SPI interface, 128 bytes of transmit and receive FIFOs, IrDA SIR built-in support
8-channel ultra-low voltage, Fm+ I2C-bus switch with reset
NTAG SmartSensor
Single UART with I2C-bus/SPI interface, 64 bytes of transmit and receive FIFOs, IrDA SIR built-in support