SOT549-1: HTSSOP32


概述

plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
HTSSOP32 surface mount double HTSSOP 6.1 x 11 x 0.9 32 plastic
生产代码 Reference Codes Issue Date
SOT549 MO-153(JEDEC 2005-11-02
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