SOT2039-2(SC): HWQFN32 | 恩智浦半导体

SOT2039-2(SC): HWQFN32


概述

HWQFN32, thermal enhanced, very-very thin quad flat package, no leads, step-cut wettable flank, 0.5 mm pitch, 5 mm x 5 mm x 0.68 mm body
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
SOT2039-2(SC) HWQFN32 surface mount quad HWQFN 5 x 5 x 0.68 plastic
生产代码 Reference Codes Issue Date
98ASA01733D 2021-10-27

Related Documents

名称/描述 类型 修改日期
封装信息 2021-11-23
部分 描述 Quick access
Power Management IC, pre-prog, 2 step-down DC/DC, ASIL-B Safety Level
Power Management IC, pre-prog, 3 step-down DC/DC, 1 LDO, QM Safety Level
Power Management IC, pre-prog, 3 step-down DC/DC, 1 LDO, QM Safety Level
Power Management IC, pre-prog, 3 step-down DC/DC, 1 LDO, QM Safety Level
Power Management IC, pre-prog, 3 step-down DC/DC, 1 LDO, ASIL-B Safety Level
Power Management IC, pre-prog, 3 step-down DC/DC, 1 LDO, QM Safety Level