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MIFARE DUOX®: High security contactless smartcard IC
As the first contactless smartcard IC in its class to combine asymmetric and symmetric cryptography in a single chip, MIFARE DUOX simplifies key management and key distribution. By adding certificate management capabilities, delivering enhanced features and security with CC EAL6+ certification, MIFARE DUOX enables high performing, highly secure and cost-effective NFC system solutions for access management, secure car access, EV-charging applications, and more.
Features
Certification and Compliancy
- ISO/IEC 14443 A levels 1-4
- ISO/IEC 7816-4
- ISO/SAE 21434 automotive cybersecurity compliant
- Common Criteria EAL 6+ certified hardware and software
- NFC Forum Tag Type 4
- MISRA-C coding standard compliant
RF Interface and ISO/IEC 14443 Type A
- Contactless interface compliant with ISO/IEC 14443-2/3 A
- Fast data transfer with baud rate of 106 kbit/s, 212 kbit/s, 424 kbit/s, 848 kbit/s and support of VHBR
- 13.56 MHz operating frequency
- Low Hmin enabling operating distance up to 100 mm (depending on power provided by the PCD and antenna geometry)
- Configurable FSCI to support up to 256-bytes frame size
Nonvolatile Memory
- User memory size of 2 kB, 4 kB, 8 kB and 16 kB
- Data retention of 25 years
- Write endurance up to 1,000,000 cycles
- True multiapplication support with secure separation between applications
- Flexible file system with data management structured into applications and files
- File access rights management via assignment of access conditions per file
- Interapplication file and data sharing
- Delegated Application Management (DAM) functionality for easy postissuance application installation of third parties
Security and Privacy
- Symmetric cryptographic algorithms: AES-128, AES-256
- Symmetric AES-based mutual authentication establishing a secure channel
- Future proof for PCQ era (Post-Quantum-Crypto) with AES-256
- Asymmetric cryptographic algorithms and key management: ECC with NIST P-256 and brainpoolP256r1 curves
- Asymmetric ECC-based mutual authentication, reader-unilateral authentication and card-unilateral authentication establishing a secure channel
- ECC signature generation via ECDSA and SHA-256
- Simplified key management and key distribution via private/public key management and PKI concept
- Key management on card level: 2 preinjected asymmetric keypairs and certificates; 11 reserved slots for symmetric keys
- Key management on application level: up to 5 certificates per application; up to 14 symmetric keys per application (in up to 16 keysets)
- Self-securing file system
- Hardware exception sensors
Extended Features
- Proximity Checks to detect relay attacks based on round-trip time measurement
- Transaction Signature and Transaction MAC generating a secure proof of executed transactions
- Transaction Timer to prevent Man-in-the-Mittle attacks
- Secure Dynamic Messaging to ensure security and integrity protected NDEF data reading
- Dynamic Originality Checks based on ECC, verifying the genuineness of the IC via card-unilateral ECC-based authentication
- NXP offered Trust Provisioning service to preinject data and key material securely by your trusted semiconductor manufacturer
EV-Charging Functionality (on "MIFARE DUOX EV" part types)
- Availability of dedicated part types for EV-Charging with "MIFARE DUOX EV"
- Support of EV-Charging specific command set as defined in VDE-AR-E 2532-100
- Preinstalled EV-Charging application and file structure as defined in VDE-AR-E 2532-100
- Preinjected key material and certificates, issued by the NXP EV-Charging CA, as defined in VDE-AR-E 2532-100
- Ready-made solution for EV-Charging and interoperability between multiple CPOs and EMSPs
Additional Aspects
- Extended operating temperature range for industrial and automotive applications: -40 °C up to +105 °C on silicon level
- Unique 7 bytes serial number (UID) for each IC, as per ISO/IEC 14443-3 requirements
- Optional configurable 4 byte random ID (RID)
- Compatibility to MIFARE DESFire application and file system layout and EV2 secure messaging
- Delivery forms as 75 µm sawn and bumped wafer and MOA8 contactless smart card module
- Input capacitance options with 17 pF and 70 pF for different form factor designs (smartcards, wristbands, key fobs, tokens, stickers, and so on)
部件编号包含： MF3E23A0DA8, MF3E23A1DUF, MF3E43A1DUF, MF3E83A0DA8, MF3E83A1DUF, MF3E93A0DA8, MF3E93A1DUF, MF3EH23A1DUF, MF3EH43A0DA8, MF3EH43A1DUF, MF3EH83A0DA8, MF3EH83A1DUF, MF3EH93A1DUF.
购买/参数
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