MMIC宽带放大器 | NXP 半导体

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MMIC宽带放大器

BGA2817
正常供应
  • 建议不要在新设计中使用本页介绍的产品。

硅单片微波集成电路(MMIC)宽带放大器，具有内部匹配电路，采用6针SOT363塑料SMD封装。

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产品详情

特征

  • 内部匹配至50 Ω
  • 2150 MHz时24.4 dB的增益
  • 1 dB增益压缩点处的输出功率 = 5 dBm（2150 MHz时）
  • 电源电流 = 20.0 mA（电源电压为3.3 V时）
  • 反向隔离度 > 39 dB（高达2150 MHz时）
  • 因二阶乘积和三阶乘积低而达到的良好线性度
  • 噪声系数 = 3.9 dB（950 MHz时）
  • 无条件稳定(K > 1)
  • 无需输出电感

Target Applications

  • LNB中频放大器
  • 适用于频率范围在直流和2.2 GHz之间的通用低噪声宽带放大器

购买/参数

2 结果

包含 1 不推荐用于新设计

部件

展开描述

订购

计算机辅助设计模型

状态

预算报价（不含税）

OM17013
数据手册

正常供应

1 @ CNY1148.80
OM7680
数据手册

正常供应

1 @ CNY1148.80
N true 0 PSPBGA2817zh 6 包装信息 Packing Information t935 1 封装信息 Package Information t790 1 手册 Brochure t518 1 支持信息 Supporting Information t531 2 数据手册 Data Sheet t520 1 zh 0 false zh zh 数据手册 Data Sheet 1 1 7.0 English Silicon Monolitic Microwave Integrated Circuit (MMIC) wideband amplifier with internal matching circuit in a 6-pin SOT363 plastic SMD package. 1442064490634726492403 PSP 180.1 KB None None documents None 1442064490634726492403 /docs/en/data-sheet/BGA2817.pdf 180144 /docs/en/data-sheet/BGA2817.pdf BGA2817 documents N N 2016-10-08 MMIC wideband amplifier /docs/en/data-sheet/BGA2817.pdf /docs/en/data-sheet/BGA2817.pdf Data Sheet N 980000996212993340 2024-08-26 pdf N en Mar 30, 2017 980000996212993340 Data Sheet Y N MMIC wideband amplifier PDF 手册 Brochure 1 2 1.0 English 1442048525382701225627 PSP 801.0 KB None None documents None 1442048525382701225627 /docs/en/brochure/75017501.pdf 801012 /docs/en/brochure/75017501.pdf 75017501 documents N N 2016-07-01 Design with confidence using our latest RF discrete /docs/en/brochure/75017501.pdf /docs/en/brochure/75017501.pdf Brochure N 712453003803778552 2024-08-22 pdf N en Jan 7, 2014 712453003803778552 Brochure Y N Design with confidence using our latest RF discrete 封装信息 Package Information 1 3 1.1 English 1455079417747706437770 PSP 214.6 KB None None documents None 1455079417747706437770 /docs/en/package-information/SOT363.pdf 214626 /docs/en/package-information/SOT363.pdf SOT363 documents N N 2016-10-08 plastic, surface-mounted package; 6 terminals; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body /docs/en/package-information/SOT363.pdf /docs/en/package-information/SOT363.pdf Package Information N 302435339416912908 2024-09-10 pdf N en Jan 9, 2017 302435339416912908 Package Information Y N plastic, surface-mounted package; 6 terminals; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body PDF 包装信息 Packing Information 1 4 1.0 English 1442131066358729037214 PSP 191.9 KB None None documents None 1442131066358729037214 /docs/en/packing/SOT363_115.pdf 191895 /docs/en/packing/SOT363_115.pdf SOT363_115 documents N 2013-02-18 TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 /docs/en/packing/SOT363_115.pdf /docs/en/packing/SOT363_115.pdf Packing Information N 145666923842250347 2022-12-07 pdf en Nov 15, 2012 145666923842250347 Packing Information N TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 支持信息 Supporting Information 2 5 1.0 English Reflow Soldering temperature profile 1442122749741692602431 PSP 34.6 KB None None documents None 1442122749741692602431 /docs/en/supporting-information/Reflow_Soldering_Profile.pdf 34577 /docs/en/supporting-information/Reflow_Soldering_Profile.pdf REFLOW_SOLDERING_PROFILE documents N N 2016-10-08 Reflow Soldering Profile /docs/en/supporting-information/Reflow_Soldering_Profile.pdf /docs/en/supporting-information/Reflow_Soldering_Profile.pdf Supporting Information N 371282830530968666 2024-11-28 pdf N en Feb 17, 2014 371282830530968666 Supporting Information Y N Reflow Soldering Profile 6 1.0 English 1442132944839723299149 PSP 106.2 KB None None documents None 1442132944839723299149 /docs/en/supporting-information/MAR_SOT363.pdf 106153 /docs/en/supporting-information/MAR_SOT363.pdf MAR_SOT363 documents N N 2013-07-12 MAR_SOT363 Topmark /docs/en/supporting-information/MAR_SOT363.pdf /docs/en/supporting-information/MAR_SOT363.pdf Supporting Information N 371282830530968666 2024-08-23 pdf N en Jun 2, 2013 371282830530968666 Supporting Information Y N MAR_SOT363 Topmark false 0 BGA2817 downloads zh-Hans true 1 Y PSP 包装信息 1 /docs/en/packing/SOT363_115.pdf 2013-02-18 1442131066358729037214 PSP 4 Nov 15, 2012 Packing Information None /docs/en/packing/SOT363_115.pdf English documents 191895 None 145666923842250347 2022-12-07 /docs/en/packing/SOT363_115.pdf TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 /docs/en/packing/SOT363_115.pdf documents 145666923842250347 Packing Information N en None pdf 1.0 N TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 191.9 KB SOT363_115 N 1442131066358729037214 封装信息 1 /docs/en/package-information/SOT363.pdf 2016-10-08 1455079417747706437770 PSP 3 Jan 9, 2017 Package Information PDF None /docs/en/package-information/SOT363.pdf English documents 214626 None 302435339416912908 2024-09-10 N /docs/en/package-information/SOT363.pdf plastic, surface-mounted package; 6 terminals; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body /docs/en/package-information/SOT363.pdf documents 302435339416912908 Package Information N en None Y pdf 1.1 N N plastic, surface-mounted package; 6 terminals; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body 214.6 KB SOT363 N 1455079417747706437770 手册 1 /docs/en/brochure/75017501.pdf 2016-07-01 1442048525382701225627 PSP 2 Jan 7, 2014 Brochure None /docs/en/brochure/75017501.pdf English documents 801012 None 712453003803778552 2024-08-22 N /docs/en/brochure/75017501.pdf Design with confidence using our latest RF discrete /docs/en/brochure/75017501.pdf documents 712453003803778552 Brochure N en None Y pdf 1.0 N N Design with confidence using our latest RF discrete 801.0 KB 75017501 N 1442048525382701225627 支持信息 2 /docs/en/supporting-information/Reflow_Soldering_Profile.pdf 2016-10-08 1442122749741692602431 PSP 5 Feb 17, 2014 Supporting Information Reflow Soldering temperature profile None /docs/en/supporting-information/Reflow_Soldering_Profile.pdf English documents 34577 None 371282830530968666 2024-11-28 N /docs/en/supporting-information/Reflow_Soldering_Profile.pdf Reflow Soldering Profile /docs/en/supporting-information/Reflow_Soldering_Profile.pdf documents 371282830530968666 Supporting Information N en None Y pdf 1.0 N N Reflow Soldering Profile 34.6 KB REFLOW_SOLDERING_PROFILE N 1442122749741692602431 /docs/en/supporting-information/MAR_SOT363.pdf 2013-07-12 1442132944839723299149 PSP 6 Jun 2, 2013 Supporting Information None /docs/en/supporting-information/MAR_SOT363.pdf English documents 106153 None 371282830530968666 2024-08-23 N /docs/en/supporting-information/MAR_SOT363.pdf MAR_SOT363 Topmark /docs/en/supporting-information/MAR_SOT363.pdf documents 371282830530968666 Supporting Information N en None Y pdf 1.0 N N MAR_SOT363 Topmark 106.2 KB MAR_SOT363 N 1442132944839723299149 数据手册 1 /docs/en/data-sheet/BGA2817.pdf 2016-10-08 1442064490634726492403 PSP 1 Mar 30, 2017 Data Sheet Silicon Monolitic Microwave Integrated Circuit (MMIC) wideband amplifier with internal matching circuit in a 6-pin SOT363 plastic SMD package. PDF None /docs/en/data-sheet/BGA2817.pdf English documents 180144 None 980000996212993340 2024-08-26 N /docs/en/data-sheet/BGA2817.pdf MMIC wideband amplifier /docs/en/data-sheet/BGA2817.pdf documents 980000996212993340 Data Sheet N en None Y pdf 7.0 N N MMIC wideband amplifier 180.1 KB BGA2817 N 1442064490634726492403 true Y Products

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6 文件

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包装信息 (1)
封装信息 (1)
手册 (1)
支持信息 (2)
数据手册 (1)

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