封装信息 (1)
应用笔记 (1)
支持信息 (1)
-
Reflow Soldering Profile[REFLOW_SOLDERING_PROFILE]
The BGU7258 is a fully integrated MMIC Low Noise Amplifier (LNA) for wireless receiver applications in the 5 GHz to 6 GHz ISM band. Manufactured in NXP’s high performance SiGe:C technology, the BGU7258 couples gain, noise figure, linearity and efficiency with the process stability and ruggedness that are the hallmarks of SiGe technology. The BGU7258 features a robust temperature-compensated internal bias network and an integral bypass / shutdown feature that stabilizes the DC operating point over temperature and enables operation in the presence of high input signals, while minimizing current consumption in bypass (standby) mode. The 1.6 mm x 1.6 mm footprint coupled with only two external components, makes the circuit board implementation of the BGU7258 LNA the smallest IEEE 802.11ac LNA with bypass solution on the market, ideal for space sensitive applications.
| | | | | |
---|---|---|---|---|---|
| | | | | |
| | | | | |
| | | | | |
| | | | | |
| | | | | |
| | | | | |
| | | | | |
| | | | | |
| | | | | |
| | | | | |
快速参考恩智浦 文档类别.
4 文件
紧凑列表
该选项下未搜到结果。
安全文件正在加载,请稍等
4 文件
紧凑列表
收到完整的详细信息。 请参阅 eCad 文件中的产品足迹等。
There are no recently viewed products to display.