LIN 2.1 / SAEJ2602-2，双LIN物理层 | NXP 半导体

安全互联汽车

工业

消费电子

技术

LIN 2.1 / SAEJ2602-2，双LIN物理层

MC33663
停产

  • 建议不要在新设计中使用MC33663。恩智浦建议任何新设计中都可采用TJA1022。

恩智浦MC33663产品系列集成了两个物理层LIN总线，专用于汽车LIN子总线应用。

  • MC33663LEF和MC33663SEF器件提供正常的波特率(20 kbps)，而MC33663JEF提供慢速波特率(10 kbps)。
  • 所有器件都集成了用于测试和编程模式的快速波特率(100 Kbps以上)
  • 出色的电磁兼容性(EMC)、辐射排放性能、静电放电(ESD)稳定性，并可在LIN总线接地短路或低功耗模式LIN总线漏电等情况下提供安全保护

查看内部电路图

查看产品图片

产品详情

框图

MC33663 PSP internal block diagram

LIN 2.1 / SAEJ2602-2 Dual LIN Physical Layer
获取框图PDF

特征

  • 工作电压范围为7.0至18 V DC，27 V DC时可正常工作，负载突降时可承受40 V电压
  • 符合LIN协议规范2.1和SAEJ2602-2
  • 非常高的抗电磁干扰性能
  • 睡眠模式下保持低待机电流
  • 过热保护
  • 永久显性状态检测
  • 通过RXD引脚实现快速波特率选择
  • 主动总线波形整形，具有出色的辐射排放性能
  • 在LIN总线和VSUP引脚上保持±15.0 kV ESD (IEC6100-4-2)
  • 5.0 V和3.3 V兼容数字输入，无需外部组件
N true 0 PSPMC33663zh 3 应用笔记 Application Note t789 2 数据手册 Data Sheet t520 1 zh 2 1 3.0 English This application note provides guidelines for handling and assembly of SOIC package during Printed Circuit Board (PCB) assembly. 10jsBvfc PSP 3.5 MB None None documents None 10jsBvfc /docs/en/application-note/AN2409.pdf 3536520 /docs/en/application-note/AN2409.pdf AN2409 N N 2016-10-31 AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note /docs/en/application-note/AN2409.pdf /docs/en/application-note/AN2409.pdf Application Note N Y 645036621402383989 2024-01-19 pdf N en Oct 21, 2014 Application Note t789 应用笔记 Application Note Y N AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note 2 2.0 English The 33663 product line integrates two physical layer LIN bus dedicated to automotive LIN sub-bus applications. 1340742472145720481515 PSP 873.5 KB None None documents None 1340742472145720481515 /docs/en/data-sheet/MC33663.pdf 873510 /docs/en/data-sheet/MC33663.pdf MC33663 N N 2012-06-26 MC33663, LIN 2.1 / SAEJ2602-2 Dual LIN Physical Layer - Data Sheet /docs/en/data-sheet/MC33663.pdf /docs/en/data-sheet/MC33663.pdf Data Sheet N Y 980000996212993340 2022-12-07 pdf N en Dec 19, 2013 Data Sheet t520 数据手册 Data Sheet Y N MC33663, LIN 2.1 / SAEJ2602-2 Dual LIN Physical Layer - Data Sheet false zh zh 应用笔记 Application Note 1 3 1.0 English The MC33781 and MC33784 together constitute NXP Semiconductors's implementation of the Distributed System Interface (DSI) Bus Standard, Version 2.02. 1225311007711718167766 PSP 1.0 MB None None documents None 1225311007711718167766 /docs/en/application-note/AN3670.pdf 1013814 /docs/en/application-note/AN3670.pdf AN3670 documents N N 2016-10-31 AN3670, Implementing a DSI Network Using the MC33781 and the MC33784 /docs/en/application-note/AN3670.pdf /docs/en/application-note/AN3670.pdf Application Note N 645036621402383989 2024-01-19 pdf N en Oct 29, 2008 645036621402383989 Application Note Y N AN3670, Implementing a DSI Network Using the MC33781 and the MC33784 false 0 MC33663 downloads zh-Hans true 1 Y PSP 应用笔记 2 /docs/en/application-note/AN3670.pdf 2016-10-31 1225311007711718167766 PSP 3 Oct 29, 2008 Application Note The MC33781 and MC33784 together constitute NXP Semiconductors's implementation of the Distributed System Interface (DSI) Bus Standard, Version 2.02. None /docs/en/application-note/AN3670.pdf English documents 1013814 None 645036621402383989 2024-01-19 N /docs/en/application-note/AN3670.pdf AN3670, Implementing a DSI Network Using the MC33781 and the MC33784 /docs/en/application-note/AN3670.pdf documents 645036621402383989 Application Note N en None Y pdf 1.0 N N AN3670, Implementing a DSI Network Using the MC33781 and the MC33784 1.0 MB AN3670 N 1225311007711718167766 /docs/en/application-note/AN2409.pdf 2016-10-31 10jsBvfc PSP 1 Oct 21, 2014 Application Note 应用笔记 This application note provides guidelines for handling and assembly of SOIC package during Printed Circuit Board (PCB) assembly. None /docs/en/application-note/AN2409.pdf English 3536520 None Application Note 2024-01-19 N /docs/en/application-note/AN2409.pdf AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note /docs/en/application-note/AN2409.pdf documents 645036621402383989 Application Note N Y en None Y t789 pdf 3.0 N N AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note 3.5 MB AN2409 N 10jsBvfc 数据手册 1 /docs/en/data-sheet/MC33663.pdf 2012-06-26 1340742472145720481515 PSP 2 Dec 19, 2013 Data Sheet 数据手册 The 33663 product line integrates two physical layer LIN bus dedicated to automotive LIN sub-bus applications. None /docs/en/data-sheet/MC33663.pdf English 873510 None Data Sheet 2022-12-07 N /docs/en/data-sheet/MC33663.pdf MC33663, LIN 2.1 / SAEJ2602-2 Dual LIN Physical Layer - Data Sheet /docs/en/data-sheet/MC33663.pdf documents 980000996212993340 Data Sheet N Y en None Y t520 pdf 2.0 N N MC33663, LIN 2.1 / SAEJ2602-2 Dual LIN Physical Layer - Data Sheet 873.5 KB MC33663 N 1340742472145720481515 true Y Products

文档

快速参考恩智浦 文档类别.

筛选条件

3 文件

紧凑列表

培训

筛选条件

1 培训

支持

您需要什么帮助?

  • Narrow your search
搜索

近期查看的产品

查看或编辑浏览历史