AFV141KH_1000 W峰值,1200-1400 MHz,50 V | NXP 半导体

1200-1400 MHz,1000 W峰值,50 V LDMOS射频功率晶体管

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特征

  • 内部预匹配的输入和输出,支持宽带运营和易用性
  • 器件可用于单端、推挽或正交配置中
  • 工作电压最高可达50 VDD
  • 高耐用性,处理的VSWR > 20:1
  • 集成的ESD保护,带有增大负电压范围,改善C类放大器运行和栅电压脉冲
  • 提供串联等效大信号阻抗参数
  • 符合RoHS规范
  • 商用L波段雷达系统

RF Performance Tables

典型脉冲性能

在1200-1400 MHz参考电路中,VDD = 50 Vdc,IDQ(A+B) = 100 mA,输入功率 = 25 W
频率
(MHz)
信号类型 输出功率
(W)
Gps
(dB)
ηD
(%)
1200脉冲
(300 µsec,12%占空比)
950峰值15.846.5
13001120峰值16.5–47.5
14001000峰值16.146.6

负载不匹配/耐用性

频率
(MHz)
信号类型 VSWR 输入功率
(W)
测试
电压
结果
1400(1)脉冲
(128 µsec,10%占空比)
> 20:1 (所有相角)31.6峰值
(3 dB过驱)
50无器件退化
1. 在1400 MHz窄带生产电路中测量。
N true 0 PSPAFV141KHzh 5 封装信息 Package Information t790 3 应用笔记 Application Note t789 1 数据手册 Data Sheet t520 1 zh zh zh 数据手册 Data Sheet 1 1 0 English AFV141KH 1000 W Peak over 1200-1400 MHz, 50 V RF power LDMOS transistor for pulse applications such as commercial L-Band radar systems 1461205389597704072758 PSP 439.1 KB None None documents None 1461205389597704072758 /docs/en/data-sheet/AFV141KH.pdf 439140 /docs/en/data-sheet/AFV141KH.pdf AFV141KH documents N N 2016-10-31 ARCHIVED - AFV141KH 1000 W Peak, 1200-1400 MHz, 50 V Data Sheet /docs/en/data-sheet/AFV141KH.pdf /docs/en/data-sheet/AFV141KH.pdf Data Sheet N 980000996212993340 2024-02-09 pdf N en Apr 20, 2016 980000996212993340 Data Sheet Y N ARCHIVED - AFV141KH 1000 W Peak, 1200-1400 MHz, 50 V Data Sheet 应用笔记 Application Note 1 2 1 English The purpose of this application note is to provide NXP Semiconductors customers with a guideline for solder reflow mounting of high power RF transistors and integrated circuits in Air Cavity Packages (ACP). S989356392744 PSP 664.6 KB None None documents None S989356392744 /docs/en/application-note/AN1908.pdf 664592 /docs/en/application-note/AN1908.pdf AN1908 documents N N 2016-10-31 AN1908 - Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages /docs/en/application-note/AN1908.pdf /docs/en/application-note/AN1908.pdf Application Note N 645036621402383989 2024-03-13 pdf N en Feb 24, 2011 645036621402383989 Application Note Y N AN1908 - Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages 封装信息 Package Information 3 3 H English 98ASB16977C, NI-1230H-4S A1003176946486 PSP 159.0 KB None None documents None A1003176946486 /docs/en/package-information/98ASB16977C.pdf 159037 /docs/en/package-information/98ASB16977C.pdf SOT1787-1 documents N N 2016-10-31 98ASB16977C, NI-1230H-4S, 41.15x10.16x4.19, Pitch 13.72, 5 Pins /docs/en/package-information/98ASB16977C.pdf /docs/en/package-information/98ASB16977C.pdf Package Information N 302435339416912908 2022-12-07 pdf N en Oct 25, 2019 302435339416912908 Package Information D N 98ASB16977C, NI-1230H-4S, 41.15x10.16x4.19, Pitch 13.72, 5 Pins 4 B English 1349216465058725247011 PSP 48.5 KB None None documents None 1349216465058725247011 /docs/en/package-information/98ASA00459D.pdf 48461 /docs/en/package-information/98ASA00459D.pdf SOT1806-2 documents N N 2016-10-31 98ASA00459D, NI-C, 32.26x10.16x4.24, Pitch 13.72, 5 Pins /docs/en/package-information/98ASA00459D.pdf /docs/en/package-information/98ASA00459D.pdf Package Information N 302435339416912908 2022-12-07 pdf N en Feb 29, 2016 302435339416912908 Package Information D N 98ASA00459D, NI-C, 32.26x10.16x4.24, Pitch 13.72, 5 Pins 5 H English 98ARB18247C, 375E-04, NI-1230S-4S B1003167510411 PSP 44.6 KB None None documents None B1003167510411 /docs/en/package-information/98ARB18247C.pdf 44578 /docs/en/package-information/98ARB18247C.pdf SOT1829-1 documents N N 2016-10-31 98ARB18247C, NI-1230S-4S, 32.26x10.16x4.19, Pitch 13.72, 5 Pins /docs/en/package-information/98ARB18247C.pdf /docs/en/package-information/98ARB18247C.pdf Package Information N 302435339416912908 2022-12-07 pdf N en Feb 23, 2016 302435339416912908 Package Information D N 98ARB18247C, NI-1230S-4S, 32.26x10.16x4.19, Pitch 13.72, 5 Pins false 0 AFV141KH downloads zh-Hans true 1 Y PSP 封装信息 3 /docs/en/package-information/98ASB16977C.pdf 2016-10-31 A1003176946486 PSP 3 Oct 25, 2019 Package Information 98ASB16977C, NI-1230H-4S None /docs/en/package-information/98ASB16977C.pdf English documents 159037 None 302435339416912908 2022-12-07 N /docs/en/package-information/98ASB16977C.pdf 98ASB16977C, NI-1230H-4S, 41.15x10.16x4.19, Pitch 13.72, 5 Pins /docs/en/package-information/98ASB16977C.pdf documents 302435339416912908 Package Information N en None D pdf H N N 98ASB16977C, NI-1230H-4S, 41.15x10.16x4.19, Pitch 13.72, 5 Pins 159.0 KB SOT1787-1 N A1003176946486 /docs/en/package-information/98ASA00459D.pdf 2016-10-31 1349216465058725247011 PSP 4 Feb 29, 2016 Package Information None /docs/en/package-information/98ASA00459D.pdf English documents 48461 None 302435339416912908 2022-12-07 N /docs/en/package-information/98ASA00459D.pdf 98ASA00459D, NI-C, 32.26x10.16x4.24, Pitch 13.72, 5 Pins /docs/en/package-information/98ASA00459D.pdf documents 302435339416912908 Package Information N en None D pdf B N N 98ASA00459D, NI-C, 32.26x10.16x4.24, Pitch 13.72, 5 Pins 48.5 KB SOT1806-2 N 1349216465058725247011 /docs/en/package-information/98ARB18247C.pdf 2016-10-31 B1003167510411 PSP 5 Feb 23, 2016 Package Information 98ARB18247C, 375E-04, NI-1230S-4S None /docs/en/package-information/98ARB18247C.pdf English documents 44578 None 302435339416912908 2022-12-07 N /docs/en/package-information/98ARB18247C.pdf 98ARB18247C, NI-1230S-4S, 32.26x10.16x4.19, Pitch 13.72, 5 Pins /docs/en/package-information/98ARB18247C.pdf documents 302435339416912908 Package Information N en None D pdf H N N 98ARB18247C, NI-1230S-4S, 32.26x10.16x4.19, Pitch 13.72, 5 Pins 44.6 KB SOT1829-1 N B1003167510411 应用笔记 1 /docs/en/application-note/AN1908.pdf 2016-10-31 S989356392744 PSP 2 Feb 24, 2011 Application Note The purpose of this application note is to provide NXP Semiconductors customers with a guideline for solder reflow mounting of high power RF transistors and integrated circuits in Air Cavity Packages (ACP). None /docs/en/application-note/AN1908.pdf English documents 664592 None 645036621402383989 2024-03-13 N /docs/en/application-note/AN1908.pdf AN1908 - Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages /docs/en/application-note/AN1908.pdf documents 645036621402383989 Application Note N en None Y pdf 1 N N AN1908 - Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages 664.6 KB AN1908 N S989356392744 数据手册 1 /docs/en/data-sheet/AFV141KH.pdf 2016-10-31 1461205389597704072758 PSP 1 Apr 20, 2016 Data Sheet AFV141KH 1000 W Peak over 1200-1400 MHz, 50 V RF power LDMOS transistor for pulse applications such as commercial L-Band radar systems None /docs/en/data-sheet/AFV141KH.pdf English documents 439140 None 980000996212993340 2024-02-09 N /docs/en/data-sheet/AFV141KH.pdf ARCHIVED - AFV141KH 1000 W Peak, 1200-1400 MHz, 50 V Data Sheet /docs/en/data-sheet/AFV141KH.pdf documents 980000996212993340 Data Sheet N en None Y pdf 0 N N ARCHIVED - AFV141KH 1000 W Peak, 1200-1400 MHz, 50 V Data Sheet 439.1 KB AFV141KH N 1461205389597704072758 true Y Products

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封装信息 (3)
应用笔记 (1)
数据手册 (1)

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