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MIFARE DUOX®: High security contactless smartcard IC
As the first contactless smartcard IC in its class to combine asymmetric and symmetric cryptography in a single chip, MIFARE DUOX simplifies key management and key distribution. By adding certificate management capabilities, delivering enhanced features and security with CC EAL6+ certification, MIFARE DUOX enables high performing, highly secure and cost-effective NFC system solutions for access management, secure car access, EV-charging applications, and more.
Features
Certification and Compliancy
- ISO/IEC 14443 A levels 1-4
- ISO/IEC 7816-4
- ISO/SAE 21434 automotive cybersecurity compliant
- Common Criteria EAL 6+ certified hardware and software
- NFC Forum Tag Type 4
- MISRA-C coding standard compliant
RF Interface and ISO/IEC 14443 Type A
- Contactless interface compliant with ISO/IEC 14443-2/3 A
- Fast data transfer with baud rate of 106 kbit/s, 212 kbit/s, 424 kbit/s, 848 kbit/s and support of VHBR
- 13.56 MHz operating frequency
- Low Hmin enabling operating distance up to 100 mm (depending on power provided by the PCD and antenna geometry)
- Configurable FSCI to support up to 256-bytes frame size
Nonvolatile Memory
- User memory size of 2 kB, 4 kB, 8 kB and 16 kB
- Data retention of 25 years
- Write endurance up to 1,000,000 cycles
- True multiapplication support with secure separation between applications
- Flexible file system with data management structured into applications and files
- File access rights management via assignment of access conditions per file
- Interapplication file and data sharing
- Delegated Application Management (DAM) functionality for easy postissuance application installation of third parties
Security and Privacy
- Symmetric cryptographic algorithms: AES-128, AES-256
- Symmetric AES-based mutual authentication establishing a secure channel
- Future proof for PQC era (Post-Quantum-Crypto) with AES-256
- Asymmetric cryptographic algorithms and key management: ECC with NIST P-256 and brainpoolP256r1 curves
- Asymmetric ECC-based mutual authentication, reader-unilateral authentication and card-unilateral authentication establishing a secure channel
- ECC signature generation via ECDSA and SHA-256
- Simplified key management and key distribution via private/public key management and PKI concept
- Key management on card level: 2 preinjected asymmetric keypairs and certificates; 11 reserved slots for symmetric keys
- Key management on application level: up to 5 certificates per application; up to 14 symmetric keys per application (in up to 16 keysets)
- Self-securing file system
- Hardware exception sensors
Extended Features
- Proximity Checks to detect relay attacks based on round-trip time measurement
- Transaction Signature and Transaction MAC generating a secure proof of executed transactions
- Transaction Timer to prevent Man-in-the-Middle attacks
- Secure Dynamic Messaging to ensure security and integrity protected NDEF data reading
- Dynamic Originality Checks based on ECC, verifying the genuineness of the IC via card-unilateral ECC-based authentication
- NXP offered Trust Provisioning service to preinject data and key material securely by your trusted semiconductor manufacturer
EV-Charging Functionality (on "MIFARE DUOX EV" part types)
- Availability of dedicated part types for EV-Charging with "MIFARE DUOX EV"
- Support of EV-Charging specific command set as defined in VDE-AR-E 2532-100
- Preinstalled EV-Charging application and file structure as defined in VDE-AR-E 2532-100
- Preinjected key material and certificates, issued by the NXP EV-Charging CA, as defined in VDE-AR-E 2532-100
- Ready-made solution for EV-Charging and interoperability between multiple CPOs and EMSPs
Additional Aspects
- Extended operating temperature range for industrial and automotive applications: -40 °C up to +105 °C on silicon level
- Unique 7 bytes serial number (UID) for each IC, as per ISO/IEC 14443-3 requirements
- Optional configurable 4 byte random ID (RID)
- Compatibility to MIFARE DESFire application and file system layout and EV2 secure messaging
- Delivery forms as 75 µm sawn and bumped wafer and MOA8 contactless smart card module
- Input capacitance options with 17 pF and 70 pF for different form factor designs (smartcards, wristbands, key fobs, tokens, stickers, and so on)
购买/参数
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