Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
HSOP36: plastic, heatsink small outline package; 36 leads; low stand-off height, 0.65 mm pitch, 11 mm x 15.9 mm x 3.35 mm body
12NC: 935297752118
详细信息
订购
12NC: 935292391118
详细信息
订购
12NC: 935292391518
详细信息
订购
参数 | 值 |
---|---|
Remark | I2C Bus diagnostic |
RMS power (W) | 4 x 28 |
参数 | 值 |
---|---|
Gain (dB) | 26 |
Channel configuration | BTL/quad |
部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | REACH SVHC | 重量(mg) |
---|---|---|---|---|---|---|
TDF8544TH/N2,118(935292391118) | No | No | - | REACH SVHC | - | |
TDF8544TH/N2,518(935292391518) | No | Yes | No | REACH SVHC | 2075.0 | |
TDF8544TH/N3,118(935297752118) | No | Yes Certificate Of Analysis (CoA) | Yes | REACH SVHC | 914.74858524 |
部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度(PPT)(C°) | ||
---|---|---|---|---|---|
铅焊接 | 无铅焊接 | 铅焊接 | 无铅焊接 | ||
TDF8544TH/N2,118 (935292391118) | - | - | - | - | - |
TDF8544TH/N2,518 (935292391518) | - | 3 | 3 | 225 | 245 |
TDF8544TH/N3,118 (935297752118) | No | 1 | 1 | 225 | 245 |
部件/12NC | 协调关税 (美国)免责声明 |
---|---|
TDF8544TH/N2,118 (935292391118) | 854233 |
TDF8544TH/N2,518 (935292391518) | 854233 |
TDF8544TH/N3,118 (935297752118) | 854233 |
部件/12NC | 停产通知 | 上次购买日期 | 上次发货日期 | 替代器件 |
---|---|---|---|---|
TDF8544TH/N2,518 (935292391518) | - | 1999-01-30 | 1999-12-31 | TDF8544TH/N3,118 (935297752118) |
The TDF8544 is one of a new generation of complementary quad Bridge-Tied Load (BTL) audio power amplifiers intended for automotive applications. It has full I²C-bus controlled diagnostics, including start-up diagnostics. The TDF8544 can operate at a battery voltage as low as 6 V making this amplifier suitable for stop/start-car operation.
The amplifier uses a complementary DMOS output stage in a Silicon-On-Insulator (SOI)- based BCD process. The DMOS output stage ensures a high power output signal with advanced sound quality. The SOI-based BCD process ensures a robust amplifier, where latch-up cannot occur, with good separation between the four independent channels, with every component isolated and without substrate currents.