Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
封装
SO8: SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 12.06 mm x 12.06 mm x 8.38 mm body
购买选项
MPXA4115AP
使用寿命终止
12NC: 935309624117
详细信息
订购
工作特点
| 参数 | 值 |
|---|---|
Security Status | COMPANY PUBLIC |
Description | SOP SIDE PORT |
| 参数 | 值 |
|---|---|
Number of pins | 8 |
Package Style | SO |
环境
| 部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | 二级互连 | REACH SVHC | 重量（mg） |
|---|---|---|---|---|---|---|---|
MPXA4115AP(935309624117) | No | Yes Certificate Of Analysis (CoA) | Yes |  | e4 | REACH SVHC | 1755.1 |
质量
| 部件/12NC | 安全保障功能安全 | 封装体峰值温度（PPT）（C°） | Maximum Time at Peak Temperatures (s) | ||
|---|---|---|---|---|---|
| 铅焊接 | 无铅焊接 | 铅焊接 | 无铅焊接 | ||
MPXA4115AP (935309624117) | No | 245 | 245 | 30 | 30 |
配送
| 部件/12NC | 协调关税 (美国)免责声明 | 出口控制分类编号 (美国) |
|---|---|---|
MPXA4115AP (935309624117) | 854239 | EAR99 |
停产和更换部件数据
| 部件/12NC | 停产通知 | 上次购买日期 | 上次发货日期 | 替代器件 |
|---|---|---|---|---|
MPXA4115AP (935309624117) | NOTICE | 2021-05-15 | 2021-11-15 | MPXAZ6115APT1 (935309625128) |
产品变更通知
| 部件/12NC | 发行日期 | 生效日期 | 产品更改通知 | 标题 |
|---|---|---|---|---|
MPXA4115AP (935309624117) | 2025-04-16 | 2025-05-26 | 202504007I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
MPXA4115AP (935309624117) | 2020-11-13 | 2020-11-14 | 202009013DN | Discontinuation Notice for Legacy Pressure Sensor Parts |
更多信息 MPXx4115
The MPxx4115 family (MPX4115A/MPXA4115A, MPXAZ4115A and MPXV4115V series) integrates on‐chip, bipolar op‐amp circuitry and thin‐film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on‐chip integration make Our pressure sensors a logical and economical choice for the system designer.
The MPxx4115 family is a state‐of‐the‐art, monolithic, signal‐conditioned silicon pressure sensor. This family combines advanced micromachining techniques, thin‐film metallization and bipolar semiconductor processing to provide an accurate high‐level analog output signal that is proportional to applied pressure.