Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
特点
PowerQUICC, 32 Bit Power Architecture, 333MHz, SoC, PCI, USB, HDLC, UTOPIA, Enet, -40 to 105C
封装
LBGA480: LBGA480, plastic, low profile ball grid array; 480 balls; 1.27 mm pitch; 37.5 mm x 37.5 mm x 1.05 mm body
购买选项
MPC8280CZUQLDA
使用寿命终止
12NC: 935313639557
详细信息
订购
工作特点
| 参数 | 值 |
|---|---|
Core Type | 603e |
Operating Frequency [Max] (MHz) | 333 |
External Memory Supported | EPROM, SDRAM, SRAM |
| 参数 | 值 |
|---|---|
Ambient Operating Temperature (Min to Max) (℃) | -40 to 105 |
Ethernet Type | 10/100 BaseT |
环境
| 部件/12NC | 无铅 | 欧盟 RoHS | RHF指标 | 二级互连 | REACH SVHC | 重量（mg） |
|---|---|---|---|---|---|---|
MPC8280CZUQLDA(935313639557) | No | No |  | e0 | REACH SVHC | 10627.2 |
质量
| 部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度（PPT）（C°） | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| 铅焊接 | 铅焊接 | 铅焊接 | |||||
MPC8280CZUQLDA (935313639557) | No | 4 | 260 | 40 | |||
配送
| 部件/12NC | 协调关税 (美国)免责声明 | 出口控制分类编号 (美国) | 脚印 | OrCAD Capture符号 |
|---|---|---|---|---|
MPC8280CZUQLDA (935313639557) | 854231 | 3A991A2 | PDF | Cadence Allegro(dra) | PDF | Orcad Capture 16.3(olb) |
停产和更换部件数据
| 部件/12NC | 停产通知 |
|---|---|
MPC8280CZUQLDA (935313639557) | - |
产品变更通知
| 部件/12NC | 发行日期 | 生效日期 | 产品更改通知 | 标题 |
|---|---|---|---|---|
MPC8280CZUQLDA (935313639557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MPC8280CZUQLDA (935313639557) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
更多信息 MPC8280
Introducing the next generation of PowerQUICC® II™ processors: the MPC8270, MPC8275 and MPC8280.
Utilizing Our HiPerMOS7 0.13-micron process technology, the next generation PowerQUICC II family offers a range of performance, feature enhancements and package options with lower power requirements. Ideal for wired and wireless infrastructure communications processing tasks, enhancements to the PowerQUICC II family offer system designers a high degree of integrated features and functionality and a compelling, proven architecture.
The next generation of PowerQUICC II processors is an optimum solution for integrated control and forwarding plane processing in high-end communications and networking equipment -- such as routers, DSLAMs, remote access concentrators, telecom switching equipment and cellular base stations. Combining extensive layer 2 functionality with control plane processing, Our PowerQUICC II processors include a high-performance embedded 603e™ core built on Power Architecture technology, and a powerful RISC-based Communications Processor Module (CPM). The CPM off-loads peripheral tasks from the embedded core and provides support for multiple communications protocols, including 10/100Mbps Ethernet, 155Mbps ATM and 256 HDLC channels. And, of course, the next generation PowerQUICC II devices retain full software compatibility with the PowerQUICC II family.
A range of performance and package options
Taking advantage of the 0.13-micron process, the next generation of PowerQUICC II devices offers significant performance increases and power savings over the current generation PowerQUICC II devices, with speeds of up to 450MHz and 300MHz in the core and CPM respectively at less than 2 watts. The new processors continue to enhance the PowerQUICC architecture's ATM support, offering up to 2 UTOPIA ports with support for up to 31 PHYs per interface -- ideal for high-density DSLAM line cards.
The next generation of PowerQUICC II solutions also delivers support for USB, an on-target addition for high performance SOHO and CPE networking equipment. And unlike most other integrated communications processors in the market, the PowerQUICC architecture integrates two processing cores to handle specific tasks: the core built on Power Architecture technology and the RISC-based CPM -- enabling a balanced approach for systems by handling both high-level tasks and low-level communications all in one integrated device.