Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
QFP160: QFP160, plastic, quad flat package; 160 terminals; 0.65 mm pitch; 28 mm x 28 mm x 3.3 mm body
12NC: 935323991557
详细信息
订购
参数 | 值 |
---|---|
Security Status | COMPANY PUBLIC |
Description | MCF5206 V2CORE 512SRAM |
参数 | 值 |
---|---|
Number of pins | 160 |
Package Style | QFP |
部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | 二级互连 | REACH SVHC | 重量(mg) |
---|---|---|---|---|---|---|---|
MCF5206AB25A(935323991557) | Yes | Yes Certificate Of Analysis (CoA) | No | e3 | REACH SVHC | 5566.8 |
部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度(PPT)(C°) | Maximum Time at Peak Temperatures (s) | |||
---|---|---|---|---|---|---|---|
无铅焊接 | 无铅焊接 | 无铅焊接 | |||||
MCF5206AB25A (935323991557) | No | 3 | 245 | 30 |
部件/12NC | 协调关税 (美国)免责声明 | 出口控制分类编号 (美国) |
---|---|---|
MCF5206AB25A (935323991557) | 854231 | 3A991A2 |
部件/12NC | 发行日期 | 生效日期 | 产品更改通知 | 标题 |
---|---|---|---|---|
MCF5206AB25A (935323991557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
Archived content is no longer updated and is made available for historical reference only.
The MCF5206 integrated microprocessor combines a ColdFire® V2 processor core with peripheral functions such as a dynamic random accesss memory (DRAM) controller, timers, parallel and serial interfaces and system integration. Designed for embedded control applications, the ColdFire core delivers enhanced performance while maintaining low system costs. To speed program execution, the on-chip instruction cache and static random access memory (SRAM) provide single-cycle access to critical code and data. The MCF5206 greatly reduces the time required for system design and implementation by packaging common system functions on-chip and providing glueless interfaces to 8-, 16-, and 32-bit DRAM, SRAM, ROM and input output (I/O) devices.