MC8640DVJ1067NE 产品信息|NXP

特点


32-Bit Power Architecture SoC, 2 X 1067MHz, DDR1/2, AltiVec, GbE, PCI-e, SRIO, 0 to 105C, Rev 3

封装


CBGA1023: CBGA1023, ceramic, ball grid array; 1023 balls; 1 mm pitch; 33 mm x 33 mm x 2.77 mm body

购买选项

MC8640DVJ1067NE

使用寿命终止

12NC: 935322061557

详细信息

订购

工作特点

参数
Security Status
COMPANY PUBLIC
Description
32-Bit Power Architecture SoC, 2 X 1067MHz, DDR1/2, AltiVec, GbE, PCI-e, SRIO, 0 to 105C, Rev 3
参数
Number of pins
1023
Package Style
BGA

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
MC8640DVJ1067NE(935322061557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
5439.7

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
MC8640DVJ1067NE
(935322061557)
No
3
245
30

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
MC8640DVJ1067NE
(935322061557)
854231
3A991A1

停产和更换部件数据

部件/12NC停产通知上次购买日期上次发货日期替代器件
MC8640DVJ1067NE
(935322061557)
NOTICE
2021-09-09
2022-09-09
-

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
MC8640DVJ1067NE
(935322061557)
2021-03-042021-03-05202102034DNDiscontinuance of P1010P1020 P1022 P2020P3041 P4080 P5040 C290 MSC8156 BSC9131837x 8548 8572 8536 8544 Families
MC8640DVJ1067NE
(935322061557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label

更多信息 MPC8640

NXP’s MPC8640D dual-core processor is engineered to deliver breakthrough performance, connectivity and integration for embedded networking, telecom, aerospace and defense, storage, industrial and pervasive computing applications.

The MPC8640D’s strength is its integration of the high-performance e600 core built on Power Architecture® technology and combined with the PowerQUICC® system-on-chip (SoC) platform. With dual-core performance and integrated northbridge and southbridge functionality, this single chip replaces what could take up to four chips using other solutions. This translates into smaller boards or higher processing density. Additionally, all core-to-peripheral connections are internal in an integrated device, so the board designer is not exposed to the difficulties of laying out high-speed parallel buses.