MC8610TPX1066JB 产品信息|NXP

MC8610TPX1066JB

使用寿命终止

MC8610TPX1066JB

使用寿命终止

特点


REV 1.1, 8610, 1.0V,-40C/105C

封装


BGA783: BGA783, plastic, ball grid array; 783 balls; 1 mm pitch; 29 mm x 29 mm x 2.7 mm body

购买选项

MC8610TPX1066JB

使用寿命终止

12NC: 935325449557

详细信息

订购

从分销商处购买

工作特点

参数
Security Status
COMPANY PUBLIC
Description
REV 1.1, 8610, 1.0V,-40C/105C
参数
Number of pins
783
Package Style
BGA

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
MC8610TPX1066JB(935325449557)
No
No
Yes
N
e0
REACH SVHC
3803.3

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
铅焊接铅焊接无铅焊接铅焊接无铅焊接
MC8610TPX1066JB
(935325449557)
No
3
245
245
30
30

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
MC8610TPX1066JB
(935325449557)
854231
3A991A1

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
MC8610TPX1066JB
(935325449557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label

更多信息 MPC8610

The MPC8610 processor is engineered to deliver breakthrough performance, connectivity and integration for embedded applications that process or display graphical images, such as kiosks, robotics, in-vehicle infotainment, cockpit displays, single-board computers and multi-function printers and scanners.

The MPC8610’s strength is its integration—the high-performance e600 core built on Power Architecture® technology—combined with the PowerQUICC® system-on-chip (SoC) platform and an LCD controller. With e600 core performance and integrated northbridge and southbridge functionality, the single chip replaces what could take up to four chips using other solutions. Moving all core-to-peripheral connections inside the device greatly reduces the number of high-speed parallel busses to be routed on the circuit board. This translates into smaller boards with fewer layers and higher processing density.