Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
12NC: 935325449557
详细信息
订购
参数 | 值 |
---|---|
Security Status | COMPANY PUBLIC |
Description | REV 1.1, 8610, 1.0V,-40C/105C |
参数 | 值 |
---|---|
Number of pins | 783 |
Package Style | BGA |
部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | 二级互连 | REACH SVHC | 重量(mg) |
---|---|---|---|---|---|---|---|
MC8610TPX1066JB(935325449557) | No | No | Yes | e0 | REACH SVHC | 3803.3 |
部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度(PPT)(C°) | Maximum Time at Peak Temperatures (s) | |||
---|---|---|---|---|---|---|---|
铅焊接 | 铅焊接 | 无铅焊接 | 铅焊接 | 无铅焊接 | |||
MC8610TPX1066JB (935325449557) | No | 3 | 245 | 245 | 30 | 30 |
部件/12NC | 协调关税 (美国)免责声明 | 出口控制分类编号 (美国) |
---|---|---|
MC8610TPX1066JB (935325449557) | 854231 | 3A991A1 |
部件/12NC | 发行日期 | 生效日期 | 产品更改通知 | 标题 |
---|---|---|---|---|
MC8610TPX1066JB (935325449557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
The MPC8610 processor is engineered to deliver breakthrough performance, connectivity and integration for embedded applications that process or display graphical images, such as kiosks, robotics, in-vehicle infotainment, cockpit displays, single-board computers and multi-function printers and scanners.
The MPC8610’s strength is its integration—the high-performance e600 core built on Power Architecture® technology—combined with the PowerQUICC® system-on-chip (SoC) platform and an LCD controller. With e600 core performance and integrated northbridge and southbridge functionality, the single chip replaces what could take up to four chips using other solutions. Moving all core-to-peripheral connections inside the device greatly reduces the number of high-speed parallel busses to be routed on the circuit board. This translates into smaller boards with fewer layers and higher processing density.