Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
购买选项
LH7A404N0F000B3,55
停产
12NC: 935285069551
详细信息
订购
LH7A404N0F000B3;55
停产
12NC: 935285069557
详细信息
订购
工作特点
| 参数 | 值 |
|---|---|
Operating Frequency [Max] (MHz) | 200 |
RAM (kB) | 80 |
GPIO | 64 |
USB Controllers | 3 |
LCD | 1 |
UART | 3 |
SPI | 1 |
| 参数 | 值 |
|---|---|
ADC (Channels) | 9 |
ADC (bits) | 10 |
Timers | 3 |
Timer (bits) | 16 |
RTC | 1 |
PWM | 2 |
Temperature range | -40 °C to +85 °C |
环境
| 部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | REACH SVHC | 重量（mg） |
|---|---|---|---|---|---|---|
LH7A404N0F000B3,55(935285069551) | Yes | Yes | No |  | REACH SVHC | 1035.74 |
LH7A404N0F000B3;55(935285069557) | Yes | Yes | No | | REACH SVHC | 1028.16270112 |
质量
| 部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度（PPT）（C°） | 适合 | MTBF | IR | ||
|---|---|---|---|---|---|---|---|---|
| 铅焊接 | 无铅焊接 | 铅焊接 | 无铅焊接 | |||||
LH7A404N0F000B3,55 (935285069551) | - | 3 | 3 | 225 | 260 | 2.84 | 2.58397932816537E8 | 0.0 |
LH7A404N0F000B3;55 (935285069557) | No | 3 | 3 | 225 | 260 | 2.84 | 2.58397932816537E8 | 0.0 |
配送
| 部件/12NC | 协调关税 (美国)免责声明 |
|---|---|
LH7A404N0F000B3,55 (935285069551) | 854231 |
LH7A404N0F000B3;55 (935285069557) | 854231 |
停产和更换部件数据
| 部件/12NC | 停产通知 | 上次购买日期 | 上次发货日期 | 替代器件 |
|---|---|---|---|---|
LH7A404N0F000B3,55 (935285069551) | - | - | - | LH7A404N0F000B3;55 (935285069557) |
LH7A404N0F000B3;55 (935285069557) | - | 2015-06-30 | 2015-09-30 | - |
产品变更通知
| 部件/12NC | 发行日期 | 生效日期 | 产品更改通知 | 标题 |
|---|---|---|---|---|
LH7A404N0F000B3;55 (935285069557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
更多信息 LH7A404N0F000B3
Archived content is no longer updated and is made available for historical reference only.
The advent of 3G technology opens up a wide range of multimedia applications in mobile information appliances. The LH7A404 is designed from the ground up with a 32‑bit Arm922T™ Core to provide high processing performance, low power consumption, and a high level of integration. Features include 80 kB on-chip SRAM, fully static design, power management unit, low voltage (1.8 V Core, 3.3 V I/O) and on-chip PLL.
NOTE:
Devices containing lead-free solder formulations have different reflow temperatures than leaded-solder formulations. When using both solder formulations on the same PC board, designers should consider the effect of different reflow temperatures on the overall PCB assembly process. Refer to www.nxp.com for an application note on recommended SOT1021-1 soldering practices.