K32L2B21VFT0A 产品信息|NXP

特点


Ultra-Low-Power, Highly Integrated MCU

封装


HUQFN48: HUQFN48, plastic, thermal enhanced ultra thin quad flatpack; no leads; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.58 mm body

购买选项

工作特点

参数
Core Type
1 x Arm Cortex-M0+
Operating Frequency [Max] (MHz)
48
Flash (kB)
128
SRAM (kB)
32
Serial Communication
1 x UART w/ ISO-7816, 2 x I²C, 2 x SPI
参数
ADC [Number, bits]
1 x 16
GPIO
36
Supply Voltage [Min to Max] (V)
1.71 to 3.6
Ambient Operating Temperature (Min to Max) (℃)
-40 to 105

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标REACH SVHC重量(mg)
K32L2B21VFT0A(935392836557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
138.4
K32L2B21VFT0AR(935392836528)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
138.4

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
K32L2B21VFT0A
(935392836557)
No
3
260
40
K32L2B21VFT0AR
(935392836528)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
K32L2B21VFT0A
(935392836557)
854231
3A991A2
K32L2B21VFT0AR
(935392836528)
854231
3A991A2

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
K32L2B21VFT0A
(935392836557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
K32L2B21VFT0A
(935392836557)
2020-10-202020-10-21202009023IK32L2B Reference Manual & Datasheet Update To Rev3

更多信息 K32-L2

The K32 L2 MCU family’s low-leakage architecture, combined with its power-optimized peripherals and security features (such as cryptographic acceleration technology, cyclic redundancy check and a true random number generator), make it ideal for consumer, industrial and IoT applications requiring a low-priced, power efficient option with longer battery life.

This family includes a low power Arm® Cortex®-M0+ core and with options scaling from 64 KB to 512 KB Flash and from 32 kB to 128 kB SRAM, the K32 L2 family offers a wide range of memory resources to fit different application tasks within a small-form factor, low power, and highly integrated design.