BGA6130 产品信息|NXP

BGA6130

使用寿命终止

BGA6130

使用寿命终止

特点


400 MHz to 2700 MHz 1 W high efficiency silicon amplifier

封装


HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals

购买选项

BGA6130,118

使用寿命终止

12NC: 935294892118

详细信息

订购

从分销商处购买

工作特点

参数
frange [min] (MHz)
400
frange [max] (MHz)
2700
ICC [typ] (mA)
70
ICC [max] (mA)
90
Gp (dB)
17
参数
Gp (dB)
14
PL(1dB) (dBm)
29
NF (dB)
4.0, 4.5
@f [max] (MHz)
902

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标REACH SVHC重量(mg)
BGA6130,118(935294892118)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
22.52554091

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)
铅焊接无铅焊接铅焊接无铅焊接
BGA6130,118
(935294892118)
No
1
1
240
260

配送

部件/12NC协调关税 (美国)免责声明
BGA6130,118
(935294892118)
854233

更多信息 BGA6130

The MMIC is a one-stage amplifier, offered in a low-cost leadless surface-mount package. At 3.6 V it delivers 29.5 dBm output power at 3 dB gain compression with efficiency higher than 55 %. Its power saving features include simple quiescent current adjustment, which allows class-AB operation and logic-level shutdown control to reduce the supply current to 4 μA.