Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
购买选项
A5M36TG140TC-EVB
正常供应
12NC: 935455672598
详细信息
订购
工作特点
| 参数 | 值 |
|---|---|
Security Status | COMPANY PUBLIC |
Description | 3400-3800 MHz RF Top-Side Cooling Evaluation Board |
环境
| 部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | REACH SVHC | 重量（mg） |
|---|---|---|---|---|---|
A5M36TG140TC-EVB(935455672598) | Not Available | No Information | Not Available | Compliant | 453592.0 |
质量
| 部件/12NC | 安全保障功能安全 |
|---|---|
A5M36TG140TC-EVB (935455672598) | No |
配送
| 部件/12NC | 协调关税 (美国)免责声明 | 出口控制分类编号 (美国) |
|---|---|---|
A5M36TG140TC-EVB (935455672598) | 903090 | EAR99 |
更多信息 TSC-EVB
NXP RF top-side cooling technology enables thinner and lighter 5G massive MIMO radios, removing the need of the dedicated RF shield and separating thermal management from RF design. The first family of NXP top-side cooled devices are designed for 64T64R (320 W) or 32T32R (200 W) mMIMO radios covering 3.3 GHz to 3.8 GHz. These modules combine NXP’s internal LDMOS and GaN semiconductor technologies to enable high gain and efficiency with wideband performance, delivering 31 dB gain and 46 percent efficiency over 400 MHz of instantaneous bandwidth.
These NXP GaN multi-chip evaluation boards are designed for the thin MIMO module series whose top-side cooling technology helps reduce the thickness and weight of the overall radio by more than 30 percent, while simplifying the design and manufacturing process.