WLCSP25_217X232: WLCSP25


概述

wafer level chip-size package; 25 bumps
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
WLCSP25 surface mount bottom UC 2.17 x 2.32 x 0.56 25 other
生产代码 Reference Codes Issue Date
WLCSP 2012-02-13
部分 描述 Quick access
Scalable Entry Level 32-bit Microcontroller (MCU) based on ARM Cortex-M0+/M0 Cores
Scalable Entry Level 32-bit Microcontroller (MCU) based on ARM Cortex-M0+/M0 Cores