SOT900-1: HBGA456

概述

plastic thermal enhanced ball grid array package; 456 balls; body 27 x 27 x 1.75 mm; heatsink

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT900-1	HBGA456	surface mount	bottom	HBGA		456	plastic

生产代码	Reference Codes	Issue Date
SOT900	MS-034(JEDEC);144E(IEC	2005-09-02

产品

部分	描述	Quick access
PNX1702EH	Connected media processor	View parametrics
PNX1701EH	Connected media processor	View parametrics
PNX1700EH	Connected media processor	View parametrics