Connected media processor | NXP 半导体

Connected media processor

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N true 0 PSPPNX1700EHzh 1 封装信息 Package Information t790 1 zh zh zh 封装信息 Package Information 1 1 1.0 English 1455078733117720992766 PSP 1.1 MB None None documents None 1455078733117720992766 /docs/en/package-information/SOT900-1.pdf 1067000 /docs/en/package-information/SOT900-1.pdf SOT900-1 documents N 2016-02-09 plastic thermal enhanced ball grid array package; 456 balls; body 27 x 27 x 1.75 mm; heatsink /docs/en/package-information/SOT900-1.pdf /docs/en/package-information/SOT900-1.pdf Package Information N 302435339416912908 2022-12-07 pdf en Feb 8, 2016 302435339416912908 Package Information Y N plastic thermal enhanced ball grid array package; 456 balls; body 27 x 27 x 1.75 mm; heatsink false 0 PNX1700EH downloads zh-Hans true 1 Y PSP 封装信息 1 /docs/en/package-information/SOT900-1.pdf 2016-02-09 1455078733117720992766 PSP 1 Feb 8, 2016 Package Information None /docs/en/package-information/SOT900-1.pdf English documents 1067000 None 302435339416912908 2022-12-07 /docs/en/package-information/SOT900-1.pdf plastic thermal enhanced ball grid array package; 456 balls; body 27 x 27 x 1.75 mm; heatsink /docs/en/package-information/SOT900-1.pdf documents 302435339416912908 Package Information N en None Y pdf 1.0 N plastic thermal enhanced ball grid array package; 456 balls; body 27 x 27 x 1.75 mm; heatsink 1.1 MB SOT900-1 N 1455078733117720992766 true Y Products

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