SOT864-1: HTSSOP24

概述

plastic thermal enhanced thin shrink small outline package; 24 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT864-1	HTSSOP24	surface mount	double	HTSSOP	4.4 x 7.8 x 0.9	24	plastic

生产代码	Reference Codes	Issue Date
SOT864	MO-153(JEDEC	2005-12-06

产品

部分	描述	Quick access
UJA1069TW24	LIN fail-safe system basis chip	View parametrics