SOT855-5: HTQFP64

概述

HTQFP64, thermal enhanced thin quad flat package; 64 terminals, 0.5 mm pitch, 10 mm x 10 mm x 1 mm body
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
 SOT855-5 HTQFP64 surface mount quad HTQFP 10 x 10 x 1 64 plastic
生产代码 Reference Codes Issue Date
98ASA01376D 2018-12-18
部分 描述 Quick access
LPC5526JBD64 View parametrics
LPC55S26JBD64 View parametrics
LPC5512JBD64 View parametrics
LPC5504JBD64 View parametrics
LPC5528JBD64 View parametrics
LPC55S04JBD64 View parametrics
LPC55S28JBD64 View parametrics
LPC5502JBD64 View parametrics
LPC55S06JBD64 View parametrics
LPC55S14JBD64 View parametrics
LPC55S69JBD64 View parametrics
LPC5516JBD64 View parametrics
LPC55S66JBD64 View parametrics
LPC5506JBD64 View parametrics
LPC5514JBD64 View parametrics
LPC55S16JBD64 High Efficiency Arm Cortex-M33-based Microcontroller View parametrics