SOT1989-1: LFBGA269 | 恩智浦半导体

SOT1989-1: LFBGA269


概述

LFBGA269, low-profile fine-pitch ball grid array package, 269 terminals, 0.8 mm pitch, 14 mm x 14 mm x 1.37 mm body
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
LFBGA269 surface mount bottom LFBGA 14 x 14 x 1.37 269
生产代码 Reference Codes Issue Date
98ASA01284D 2018-07-06
部分 描述 Quick access
S32R29 multicore Power Architecture, 500 MHz, ISO 26262, AEC-Q100, CSE3 Security
S32R29 multicore Power Architecture, 500 MHz, ISO 26262, AEC-Q100, CSE3 Security
S32R29 multicore Power Architecture, 266 MHz, ISO 26262, AEC-Q100, CSE3 Security
S32R29 multicore Power Architecture, 240 MHz, ISO 26262, AEC-Q100, CSE3 Security
S32R29 multicore Power Architecture, 240 MHz, ISO 26262, AEC-Q100, CSE3 Security
S32R29 multicore Power Architecture, 500 MHz, ISO 26262, AEC-Q100, CSE3 Security
S32R29 multicore Power Architecture, 266 MHz, ISO 26262, AEC-Q100, CSE3 Security