SOT1919-1: LFBGA157


概述

LFBGA157, low profile, fine-pitch ball grid array package, 157 terminals, 0.5 mm pitch, 8 mm x 8 mm x 1.25 mm body
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
LFBGA157 surface mount bottom LFBGA 8 x 8 x 1.25 157
生产代码 Reference Codes Issue Date
98ASA01073D 2017-06-12
部分 描述 Quick access
Layerscape Access, -40 °C to 105 °C, standard speed, 1 VSPA, x1 PCIe, standard firmware, Rev A0, production
Layerscape Access, 0 °C to 105 °C, standard speed, 1 VSPA, x1 PCIe, standard firmware, Rev A0, production