SOT1744-1: HBGA668

概述

HBGA668, plastic, thermal enhanced ball grid array; 668 balls; 1 mm pitch; 29 mm x 29 mm x 1.8 mm body

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT1744-1	HBGA668	surface mount	bottom	HBGA	29 x 29 x 1.8	668	plastic

生产代码	Reference Codes	Issue Date
98ASA10735D	HT-PBGA-B668(JEDEC	2017-06-11

产品

部分	描述	Quick access
MPC8358CVRAGDDA	PowerQUICC, 32 Bit Power Arch SoC, 400MHz, DDR1/2, PCI, 1GbE, USB, TDM, ATM, -40 to 105C, Rev 1	View parametrics
MPC8358VRADDDA	PowerQUICC, 32 Bit Power Arch SoC, 266MHz, DDR1/2, PCI, 1GbE, USB, TDM, ATM, 0 to 105C, Rev 1	View parametrics
MPC8358VRAGDDA	PowerQUICC, 32 Bit Power Arch SoC, 400MHz, DDR1/2, PCI, 1GbE, USB, TDM, ATM, 0 to 105C, Rev 1	View parametrics
MPC8358CVRADDDA	PowerQUICC, 32 Bit Power Arch SoC, 266MHz, DDR1/2, PCI, 1GbE, USB, TDM, ATM, -40 to 105C, Rev 1	View parametrics
MPC8358EVRAGDDA	PowerQUICC, 32 Bit Power Arch SoC, 400MHz, DDR1/2, PCI, 1GbE, USB, TDM, ATM, SEC, 0 to 105C, Rev 1	View parametrics
MPC8358EVRAGDGA	PowerQUICC, 32 Bit Power Arch SoC, 400MHz, DDR1/2, PCI, 1GbE, USB, TDM, ATM, SEC, 0 to 105C, Rev 1	View parametrics
MPC8358VRAGDGA	PowerQUICC, 32 Bit Power Arch SoC, 400MHz, DDR1/2, PCI, 1GbE, USB, TDM, ATM, 0 to 105C, Rev 1	View parametrics
MPC8358ECVRAGDDA	PowerQUICC, 32 Bit Power Arch SoC, 400MHz, DDR1/2, PCI, 1GbE, USB, TDM, ATM, SEC, -40 to 105C, Rev 1	View parametrics
MPC8358CVRAGDGA	PowerQUICC, 32 Bit Power Arch SoC, 400MHz, DDR1/2, PCI, 1GbE, USB, TDM, ATM, -40 to 105C, Rev 1	View parametrics
MPC8358ECVRAGDGA	PowerQUICC, 32 Bit Power Arch SoC, 400MHz, DDR1/2, PCI, 1GbE, USB, TDM, ATM, SEC, -40 to 105C, Rev 1	View parametrics