SOT1528-1: BGA416


概述

BGA416, plastic, ball grid array; 416 bumps; 1.0 mm pitch; 27 mm x 27 mm x 2.02 mm body
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
BGA416 surface mount bottom BGA 27 x 27 x 2.02 416 plastic
生产代码 Reference Codes Issue Date
98ASA00562D 2017-03-27
部分 描述 Quick access
NXP 32-bit MCU, Power Arch cores, 8MB Flash, 300 MHz, -40/+125degC, Automotive Grade, 416 MAP
NXP 32-bit MCU, Power Arch cores, 8MB Flash, 264 MHz, -40/+125degC, Automotive Grade, 416 MAP