SOT1397-6: WLCSP20

概述

WLCSP20, wafer level chip-scale package; 20 bumps; 1.70 mm x 2.16 mm x 0.525 mm body (backside coating included)

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT1397-6	WLCSP20	surface mount	bottom	WLCSP	1.70 x 2.16 x 0.525	20

生产代码	Reference Codes	Issue Date
SOT1397		2017-01-19

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