For best experience this site requires Javascript to be enabled. To enable on your browser, follow our
accessibility instructions
.
×
My Account
Orders
Sign Out
En
English
ä¸æ
æ¥æ¬èª
íêµì´
产品信息
封装
封装搜索
SOT1384-5: WLCSP9
SOT1384-5: WLCSP9
概述
wafer level chip-scale package; 9 bumps; 1.24 mm x 1.24 mm x 0.525 mm body (backside coating included)
Package Version
Package Name
贴装
端子位置
封装风格
尺寸
終止計數
材料
SOT1384-5
WLCSP9
surface mount
bottom
WLCSP
1.24 x 1.24 x 0.525
生产代码
Reference Codes
Issue Date
SOT1384
2018-08-08