SOT1172-2: HTSSOP28

概述

plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT1172-2	HTSSOP28	surface mount	double	HTSSOP	9.7 x 4.4 x 0.9	28	plastic

生产代码	Reference Codes	Issue Date
SOT1172	MO-153(JEDEC	2010-07-13

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