OL-NVT4857: WLCSP


概述

wafer level chip-scale package; 20 bumps; 2.1 x 1.7 x 0.49 mm (Backside coating included)
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
WLCSP surface mount bottom UC 2.1 x 1.7 x 0.49 20 plastic
生产代码 Reference Codes Issue Date
OL-NVT4857 2015-07-21
部分 描述 Quick access
SD 3.0-SDR104 compliant integrated auto-direction control memory card with EMI filter and ESD protection