T1014NXN7PQA

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of T1014NXN7PQALast Revision (GMT):
Tuesday, 05 November 2024, 06:08:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
T1014NXN7PQASOT1652FBGA7801502.023000 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 128 875572023-11-2483 / 168 hours25030 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-3120.75660889.6000008.039598
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.2129570.9000000.080755
Nickel and its compoundsNickel, metal7440-02-00.6738650.5000000.044864
Silver and its compoundsSilver, metal7440-22-40.4245350.3150000.028264
Tin and its compoundsTin, metal7440-31-511.7050358.6850000.779285
Subtotal134.773000100.00000008.972765
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.9684000.5000000.064473
Silver and its compoundsSilver, metal7440-22-45.8104003.0000000.386838
Tin and its compoundsTin, metal7440-31-5186.90120096.50000012.443298
Subtotal193.680000100.000000012.894609
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-8443.04718399.99000029.496698
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0443090.0100000.002950
Subtotal443.091492100.000000029.499648
Solder BallCopper and its compoundsCopper, metal7440-50-80.5751670.5000000.038293
Silver and its compoundsSilver, metal7440-22-43.4510013.0000000.229757
Tin and its compoundsTin, metal7440-31-5111.00719796.5000007.390512
Subtotal115.033365100.00000007.658562
Solder MaskAromatic amines and their salts1,3,5-Triazine-2,4,6-triamine108-78-10.0327020.1000000.002177
Barium and its compoundsBarium sulfate7727-43-79.64714229.5000000.642277
Inorganic compoundsOther inorganic compounds0.1962130.6000000.013063
Magnesium and its compoundsTalc14807-96-61.0464703.2000000.069671
Organic compoundsOther organic compounds.0.7521502.3000000.050076
PolymersPlastic: EP - Epoxide, Epoxy6.47503119.8000000.431087
PolymersPlastic: PAK14.55246944.5000000.968858
Subtotal32.702178100.00000002.177209
Substrate Build UpEpoxy ResinsBisphenol A diglycidyl ether1675-54-315.13753910.4500001.007810
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-515.13753910.4500001.007810
Inorganic Silicon compoundsSilicon dioxide7631-86-960.62258341.8500004.036062
PolymersPlastic: EP - Epoxide, Epoxy53.95916937.2500003.592433
Subtotal144.856830100.00000009.644115
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3207.84306750.00000013.837542
Inorganic Silicon compoundsSilica, vitreous60676-86-083.13722720.0000005.535017
PolymersPlastic: EP - Epoxide, Epoxy124.70584030.0000008.302525
Subtotal415.686134100.000000027.675085
UnderfillUnderfillInorganic Silicon compoundsSilica, vitreous60676-86-013.32000060.0000000.886804
Inorganic compoundsCarbon Black1333-86-40.0222000.1000000.001478
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.1998000.9000000.013302
PolymersPlastic: EP - Epoxide, Epoxy8.65800039.0000000.576423
Subtotal22.200000100.00000001.478007
Total1502.023000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 T1014NXN7PQA
Product content declaration of T1014NXN7PQA
上次修订 Last Revision (GMT):
Tuesday, 05 November 2024, 06:08:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

焊锡球
Solder Ball
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机底物堆积
Substrate Build Up
OOOOOO

有机基质芯
Substrate Core
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of T1014NXN7PQALast Revision (GMT):
Tuesday, 05 November 2024, 06:08:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Semiconductor DieTest Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Solder Ball - SAC, Lead FreeTest Report
26 Jan 2024
Test Report
26 Jan 2024
Test Report
26 Jan 2024
Test Report
26 Jan 2024
SubstrateAUS703Test Report
18 Mar 2024
Test Report
18 Mar 2024
Test Report
10 Nov 2022
Test Report
10 Nov 2022
CU FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
E700GRTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
GX-13Test Report
4 Mar 2024
Test Report
4 Mar 2024
Test Report
4 Mar 2024
Test Report
4 Mar 2024
PHP-900 IR-6Test Report
18 Mar 2024
Test Report
18 Mar 2024
Test Report
20 Apr 2023
Test Report
17 Feb 2022
UnderfillTest Report
11 Sep 2024
Test Report
11 Sep 2024
Test Report
11 Sep 2024
Test Report
11 Sep 2024
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.